Semiconductor device

ABSTRACT

A nitride insulating film which prevents diffusion of hydrogen into an oxide semiconductor film in a transistor including an oxide semiconductor is provided. Further, a semiconductor device which has favorable electrical characteristics by using a transistor including a silicon semiconductor and a transistor including an oxide semiconductor is provided. Two nitride insulating films having different functions are provided between the transistor including a silicon semiconductor and the transistor including an oxide semiconductor. Specifically, a first nitride insulating film which contains hydrogen is provided over the transistor including a silicon semiconductor, and a second nitride insulating film which has a lower hydrogen content than the first nitride insulating film and functions as a barrier film against hydrogen is provided between the first nitride insulating film and the transistor including an oxide semiconductor.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The invention disclosed in this specification and the like relates to asemiconductor device including transistors and further relates to anitride insulating film included in the semiconductor device.

2. Description of the Related Art

In recent years, technical development on high-speed operation ofsemiconductor devices including central processing units (also referredto as CPUs) and the like has been actively conducted. CPUs includesemiconductor integrated circuits including logic circuits.Semiconductor integrated circuits include transistors, memories, andelectrodes serving as connection terminals, which are formed oversemiconductor wafers.

As technical development on high-speed operation, semiconductor elementssuch as transistors are reduced in size to improve the operation speedand the degree of integration of CPUs.

By a reduction in size of a semiconductor element such a transistor, thedegree of integration of a CPU is improved and the operation speedthereof is also improved; however, leakage current in the transistor isincreased. As a result, the power consumption of the CPU is increased.

Semiconductor films which are applicable to transistors can be formedusing not only widely known silicon semiconductors but also metal oxidesexhibiting semiconductor characteristics (hereinafter referred to asoxide semiconductors).

For example, a technique for forming a transistor in which zinc oxide oran In—Ga—Zn-based oxide semiconductor is used as an oxide semiconductorin a channel formation region is disclosed (see Patent Documents 1 and2).

In addition, a technique for manufacturing a highly integratedsemiconductor device which consumes less power by being provided with atransistor using an oxide semiconductor over a transistor using a singlecrystal silicon semiconductor is disclosed (see Patent Document 3).

REFERENCE Patent Documents

-   [Patent Document 1] Japanese Published Patent Application No.    2007-123861-   [Patent Document 2] Japanese Published Patent Application No.    2007-096055-   [Patent Document 3] Japanese Published Patent Application No.    2011-109079

In a transistor including an oxide semiconductor, when an element whichhas been released from an insulating film or the like included in thetransistor diffuses as an impurity into an oxide semiconductor filmincluding a channel formation region, the electrical characteristics(typically the threshold voltage) of the transistor are changed and thusthe reliability of the semiconductor device might be reduced.

For example, in the case where hydrogen (including a hydrogen compoundsuch as water) is contained in the insulating film included in thetransistor, the hydrogen diffuses into the oxide semiconductor film,whereby the electrical characteristics of the transistor are changed andthus the reliability of the semiconductor device is reduced.

Hydrogen which has entered the oxide semiconductor film reacts withoxygen bonded to a metal atom to generate water, and a defect is formedin a lattice from which oxygen is released (or a portion from whichoxygen is removed). In addition, a bond of part of hydrogen and oxygencauses generation of electrons serving as carrier. Accordingly, thetransistor including the oxide semiconductor film which hydrogen hasentered is likely to have normally-on characteristics.

Note that a transistor including an oxide semiconductor film is ann-channel transistor; therefore, in this specification, a transistorwhich can be regarded as having no drain current flowing therein when agate voltage is 0 V is defined as a transistor having normally-offcharacteristics.

Thus, an object of one embodiment of the present invention is to providea nitride insulating film which prevents diffusion of hydrogen into anoxide semiconductor film.

In order to obtain favorable electrical characteristics of a transistorincluding a silicon semiconductor region, it is known that the siliconsemiconductor region including a channel formation region is subjectedto hydrogenation treatment. Note that in this specification and thelike, a silicon semiconductor refers to all semiconductor materials thatinclude silicon, e.g., silicon, silicon carbide, and silicon germanium.

The hydrogenation treatment is performed by heat treatment in a hydrogenatmosphere, an ion implantation method, an ion doping method, or thelike and has problems in view of treatment time, safety, cost, and thelike. Therefore, it is very valuable to facilitate the hydrogenationtreatment in terms of reliability, cost, and the like.

For example, even in the case where a semiconductor device including alogic circuit, a semiconductor integrated circuit, and the like is theone in which a transistor including an oxide semiconductor is providedover a transistor including single crystal silicon, hydrogenationtreatment is necessary for the transistor including single crystalsilicon to have favorable electrical characteristics.

Thus, another object of one embodiment of the present invention is toprovide a semiconductor device which has favorable electricalcharacteristics by using a transistor including a silicon semiconductorand a transistor including an oxide semiconductor.

Further, another object of one embodiment of the present invention is toprovide a semiconductor device which has favorable reliability by usinga transistor including a silicon semiconductor and a transistorincluding an oxide semiconductor.

Furthermore, another object of one embodiment of the present inventionis to achieve at least one of the objects.

SUMMARY OF THE INVENTION

In view of the objects, one embodiment of the present invention is asemiconductor device in which a plurality of transistors including atransistor including a silicon semiconductor and a transistor includingan oxide semiconductor is provided. To increase the degree ofintegration in the semiconductor device, the transistor including anoxide semiconductor is provided to be stacked over the transistorincluding a silicon semiconductor and two nitride insulating filmshaving different functions are provided therebetween. Specifically, afirst nitride insulating film which contains hydrogen is provided overthe transistor including a silicon semiconductor, and a second nitrideinsulating film which has a lower hydrogen content than the firstnitride insulating film and functions as a barrier film against hydrogenis provided between the first nitride insulating film and the transistorincluding an oxide semiconductor. Note that the second nitrideinsulating film which has a lower hydrogen content than the firstnitride insulating film and functions as a barrier film against hydrogenmay be provided to be stacked over the first nitride insulating film.

One embodiment of the present invention is a semiconductor device inwhich a plurality of transistors is stacked. The semiconductor deviceincludes a first transistor including a channel formation region in asilicon semiconductor region, a second transistor provided over thefirst transistor and including a channel formation region in an oxidesemiconductor film, a first nitride insulating film provided between thefirst transistor and the second transistor, and a second nitrideinsulating film provided between the first nitride insulating film andthe second transistor. The first nitride insulating film containshydrogen, and the second nitride insulating film has a lower hydrogencontent than the first nitride insulating film and serves as a barrierfilm against hydrogen. Note that the second nitride insulating film maybe stacked over the first nitride insulating film.

One embodiment of the present invention has the above structure in whichthe number of hydrogen molecules released from the first nitrideinsulating film is greater than or equal to 5.0×10²³ molecules/cm³ whenmeasured by thermal desorption spectroscopy, the refractive index of thesecond nitride insulating film with respect to light having a wavelengthof 633 nm is 1.95 or more when measured by spectroscopic ellipsometry,and the etching rate of the second nitride insulating film is less thanor equal to 2.0 nm/minute under a condition where etching is performedat a temperature higher than or equal to 20° C. and lower than or equalto 25° C. with the use of 0.5 wt % of hydrofluoric acid. Further, thefilm density of the second nitride insulating film is greater than orequal to 2.75 g/cn³ when measured by X-ray reflectometry.

In general, as a formed film becomes denser, the refractive index of thefilm is increased and the etching rate of the film is reduced.Accordingly, by forming the second nitride insulating film using anitride insulating film having a refractive index and an etching rate inthe above ranges, the second nitride insulating film can be a densefilm, so that the second nitride insulating film can exhibit a barrierproperty against hydrogen. Further, as a formed film becomes denser, thedensity of the film is increased; therefore, in order that the secondnitride insulating film can sufficiently exhibit a barrier propertyagainst hydrogen, the second nitride insulating film is preferablyformed using a nitride insulating film having a density in the aboverange.

In addition, the number of hydrogen molecules released from the firstnitride insulating film is greater than or equal to 5.0×10²³molecules/cm³ when measured by thermal desorption spectroscopy, andhydrogen is released from the first nitride insulating film by heating.

Further, the hydrogen concentration of the first nitride insulating filmwhich releases hydrogen by heating is higher than or equal to 20 atomic% and lower than or equal to 25 atomic % when measured by Rutherfordbackscattering spectrometry. The hydrogen concentration of the secondnitride insulating film which has a barrier property against hydrogen ishigher than or equal to 10 atomic % and lower than or equal to 15 atomic% when measured by Rutherford backscattering spectrometry. In thismanner, as the concentration of hydrogen contained in the nitrideinsulating film becomes lower, the nitride insulating film becomes lesslikely to release hydrogen, so that the nitride insulating film exhibitsa barrier property against hydrogen. For example, the first nitrideinsulating film and the second nitride insulating film can be formed ofnitride silicon films.

In the above structure, the first transistor and the second transistoreach have a top-gate structure.

Further, one embodiment of the present invention is a semiconductordevice in which a third nitride insulating film which has the samestructure as the second nitride insulating film is provided over thesecond transistor.

The first nitride insulating film releases hydrogen by being heated;therefore, when the first nitride insulating film is provided, hydrogenwhich has been released by heat treatment or the like in themanufacturing process of the semiconductor device can move to thesilicon semiconductor region of the first transistor, whereby thesilicon semiconductor region of the first transistor can be subjected tohydrogenation treatment.

The second nitride insulating film is formed of an insulating film whichis less likely to transmit hydrogen diffusing into the oxidesemiconductor film and thus can be considered as having a barrierproperty against hydrogen. Further, the second nitride insulating filmcan also be referred to as an insulating film which prevents diffusionof hydrogen into the oxide semiconductor film, or an insulating filmwhich protects the oxide semiconductor film from the hydrogen diffusinginto the oxide semiconductor film.

In addition, one embodiment of the present invention is a semiconductordevice which has the above structure and further includes an oxideinsulating film provided between and in contact with the first nitrideinsulating film and the second nitride insulating film. The oxideinsulating film can be a silicon oxide film or a silicon oxynitridefilm.

The second nitride insulating film has a lower hydrogen concentrationthan the first nitride insulating film and is formed of a dense nitrideinsulating film. Therefore, the second nitride insulating film functionsas a barrier film against hydrogen. In the case where the first nitrideinsulating film which is formed of a nitride insulating film containinghydrogen is provided in contact with the second nitride insulating film,depending on the formation method of the second nitride insulating film,hydrogen which is contained in the first nitride insulating film mightbe mixed into the second nitride insulating film to increase thehydrogen concentration of the second nitride insulating film. Therefore,the oxide insulating film is provided between the first nitrideinsulating film and the second nitride insulating film as describedabove, whereby the hydrogen contained in the first nitride insulatingfilm can be prevented from mixing into the second nitride insulatingfilm at the time of forming the second nitride insulating film, and thusthe second nitride insulating film can sufficiently function as abarrier film against hydrogen.

Furthermore, one embodiment of the present invention is a nitrideinsulating film which is applicable to the second nitride insulatingfilm, in particular, a silicon nitride film which is applicable to thesecond nitride insulating film.

According to one embodiment of the present invention, a nitrideinsulating film which prevents diffusion of hydrogen into an oxidesemiconductor film can be provided.

According to one embodiment of the present invention, hydrogenationtreatment can be safely and easily performed in the transistor includinga silicon semiconductor.

According to one embodiment of the present invention, a semiconductordevice which has favorable electrical characteristics can be provided byusing a transistor including a silicon semiconductor and a transistorincluding an oxide semiconductor.

According to one embodiment of the present invention, a semiconductordevice which has favorable reliability by using a transistor including asilicon semiconductor and a transistor including an oxide semiconductorcan be provided.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A and 1B are a cross-sectional view and a circuit diagramillustrating a semiconductor device that is one embodiment of thepresent invention.

FIG. 2 is a top view illustrating a semiconductor device that is oneembodiment of the present invention.

FIGS. 3A to 3C are cross-sectional views illustrating a method formanufacturing a semiconductor device that is one embodiment of thepresent invention.

FIGS. 4A and 4B are cross-sectional views illustrating a method formanufacturing a semiconductor device that is one embodiment of thepresent invention.

FIGS. 5A and 5B are cross-sectional views illustrating a method formanufacturing a semiconductor device that is one embodiment of thepresent invention.

FIG. 6 is a cross-sectional view illustrating a semiconductor devicethat is one embodiment of the present invention.

FIG. 7 is a cross-sectional view illustrating a semiconductor devicethat is one embodiment of the present invention.

FIGS. 8A to 8C are cross-sectional views illustrating a method formanufacturing a semiconductor device that is one embodiment of thepresent invention.

FIG. 9 is a cross-sectional view illustrating a method for manufacturinga semiconductor device that is one embodiment of the present invention.

FIGS. 10A and 10B are each a cross-sectional view illustrating asemiconductor device that is one embodiment of the present invention.

FIGS. 11A to 11C are a cross-sectional view and circuit diagramsillustrating a semiconductor device that is one embodiment of thepresent invention.

FIG. 12 is a top view illustrating a semiconductor device that is oneembodiment of the present invention.

FIG. 13 is a cross-sectional view illustrating a semiconductor devicethat is one embodiment of the present invention.

FIGS. 14A to 14C are a cross-sectional view and circuit diagramsillustrating a semiconductor device that is one embodiment of thepresent invention.

FIGS. 15A and 15B are each a cross-sectional view illustrating asemiconductor device that is one embodiment of the present invention.

FIG. 16 is a circuit diagram illustrating a semiconductor device that isone embodiment of the present invention.

FIG. 17 is a perspective view illustrating a semiconductor device thatis one embodiment of the present invention.

FIG. 18 is a cross-sectional view of a transistor which is applicable toa semiconductor device that is one embodiment of the present invention.

FIGS. 19A to 19C are block diagrams illustrating a semiconductor devicethat is one embodiment of the present invention.

FIGS. 20A to 20C illustrate electronic appliances.

FIGS. 21A and 21B each illustrate a structure of a sample.

FIGS. 22A and 22B show results of thermal desorption spectroscopy.

FIGS. 23A and 23B show measurement results of a refractive index and afilm density.

FIG. 24 shows measurement results of an etching rate.

FIGS. 25A and 25B show measurement results of a refractive index and afilm density.

FIG. 26 shows measurement results of an etching rate.

DETAILED DESCRIPTION OF THE INVENTION

Hereinafter, embodiments and examples of the present invention will bedescribed in detail with reference to the accompanying drawings.However, the present invention is not limited to the description below,and it is easily understood by those skilled in the art that modes anddetails disclosed herein can be modified in various ways withoutdeparting from the spirit and the scope of the present invention.Therefore, the present invention is not construed as being limited todescription of the embodiments and examples.

Note that in structures of the present invention described below, thesame portions or portions having similar functions are denoted by thesame reference numerals in different drawings, and description thereofis not repeated. Further, the same hatching pattern is applied toportions having similar functions, and the portions are not especiallydenoted by reference numerals in some cases.

Note that, in each drawing described in this specification, the size,the film thickness, or the region of each component is exaggerated forclarity in some cases. Therefore, the embodiments and examples of thepresent invention are not limited to such scales.

Note that ordinal numbers such as “first” and “second” in thisspecification and the like are used for convenience and do not denotethe order of steps or the stacking order of layers. In addition, theordinal numbers in this specification and the like do not denoteparticular names which specify the invention.

Functions of a “source” and a “drain” in the present invention aresometimes replaced with each other when the direction of a currentflowing is changed in circuit operation, for example. Therefore, theterms “source” and “drain” can be replaced with each other in thisspecification.

Note that a voltage refers to a difference between potentials of twopoints, and a potential refers to electrostatic energy (electricpotential energy) of a unit charge at a given point in an electrostaticfield. Note that in general, a difference between a potential of onepoint and a reference potential is merely called a potential or avoltage, and a potential and a voltage are used as synonymous words inmany cases. Thus, in this specification, a potential may be rephrased asa voltage and a voltage may be rephrased as a potential unless otherwisespecified.

In this specification, in the case where etching treatment is performedafter photolithography treatment, a mask formed by the photolithographytreatment is removed.

Embodiment 1

In the present embodiment, a semiconductor device that is one embodimentof the present invention is described with reference to drawings.

<Structure of Semiconductor Device>

FIG. 1A is a cross-sectional view illustrating a semiconductor devicethat is one embodiment of the present invention. The semiconductordevice illustrated in FIG. 1A includes a plurality of transistors, andsome of the transistors are stacked in the longitudinal direction inorder to increase the degree of integration.

Specifically, a complementary metal oxide semiconductor (CMOS) circuit105 in which a transistor 101 that is an n-channel transistor includinga first semiconductor material and a transistor 103 that is a p-channeltransistor are electrically connected to each other is provided in alower portion; a capacitor 107 and a transistor 109 that is an n-channeltransistor including a second semiconductor material are provided overthe CMOS circuit 105; a first nitride insulating film 111 which containshydrogen and releases hydrogen by heating is provided over thetransistor 101 and the transistor 103; and a second nitride insulatingfilm 113 which has a lower hydrogen content than the first nitrideinsulating film 111 and functions as a barrier film against hydrogen isprovided between the first nitride insulating film 111 and thetransistor 109.

FIG. 1B is a circuit diagram corresponding to the semiconductor devicein FIG. 1A. The connection relation in the circuit diagram in FIG. 1B isas follows. The capacitor 107 is electrically connected to the CMOScircuit 105 in which the transistor 101 and the transistor 103 areelectrically connected to each other, and the transistor 109 includingan oxide semiconductor is electrically connected to the CMOS circuit 105and the capacitor 107. Note that another transistor may be electricallyconnected to the transistor 109.

A semiconductor material other than an oxide semiconductor, such as asilicon semiconductor, is used as the first semiconductor material, andan oxide semiconductor is used as the second semiconductor material.That is, the transistors 101 and 103 are each a transistor including asilicon semiconductor, and the transistor 109 is a transistor includingan oxide semiconductor.

The transistors 101 and 103 are formed using a silicon semiconductor andthus transistors which operate at a high speed can be easilymanufactured as the transistors 101 and 103 by using a single crystalsubstrate or a polycrystalline substrate.

Meanwhile, it is possible to easily manufacture, as the transistorincluding an oxide semiconductor, a transistor in which leakage current(also referred to as off-state leakage current or off-state current) isreduced by high purification by removal of impurities such as hydrogenfrom an oxide semiconductor film including a channel formation region.Thus, power consumption of the semiconductor device can be reduced.

The first nitride insulating film 111 is formed of a nitride insulatingfilm which contains hydrogen and releases hydrogen by heating.Specifically, the number of hydrogen molecules released from the nitrideinsulating film is greater than or equal to 5.0×10²³ molecules/cm³ whenmeasured by thermal desorption spectroscopy (hereinafter referred to asTDS). Further, the hydrogen concentration of the nitride insulating filmis higher than or equal to 20 atomic % and lower than or equal to 25atomic % when measured by Rutherford backscattering spectrometry. As thenitride insulating film, for example, a silicon nitride film, a siliconnitride oxide film, or the like can be given.

To achieve favorable electrical characteristics of the transistors 101and 103 including a silicon semiconductor, it is preferable thathydrogenation treatment be performed in the manufacturing processes ofthe transistors so that at least defects (dangling bonds) which areincluded in a silicon semiconductor region including the channelformation region are repaired (terminated with hydrogen). Thus, thefirst nitride insulating film 111 is provided over the transistor 101and the transistor 103, whereby the hydrogenation treatment can beperformed using hydrogen which is released from the first nitrideinsulating film 111. In this manner, hydrogenation treatment can besafely and easily performed, unlike in a conventional method. Forexample, the hydrogenation treatment can be performed by performing heattreatment after the first nitride insulating film 111 is provided in themanufacturing process of the semiconductor device, which results in areduction in time necessary for manufacturing the semiconductor deviceand an improvement in productivity of the semiconductor device.

The second nitride insulating film 113 is an insulating film which has alower hydrogen content than the first nitride insulating film 111 andfunctions as a barrier film against hydrogen. Further, the secondnitride insulating film 113 is an insulating film which prevents atleast hydrogen which is released from the first nitride insulating film111 from diffusing into the oxide semiconductor film (specifically, achannel formation region) of the transistor 109, or an insulating filmwhich protects the channel formation region from hydrogen which diffusesinto the oxide semiconductor film of the transistor 109.

Thus, a dense nitride insulating film which has a low hydrogen contentcan be used as the second nitride insulating film 113. Specifically,characteristics of the nitride insulating film which can be used as thesecond nitride insulating film 113 are as follows: the refractive indexis greater than or equal to 1.95 to light having a wavelength of 633 nmwhen measured by spectroscopic ellipsometry, and the etching rate islower than or equal to 2.0 nm/min when the etching is performed at atemperature higher than or equal to 20° C. and lower than or equal to25° C. with the use of a 0.5 weight % of hydrofluoric acid.Alternatively, characteristics of the nitride insulating film which canbe used as the second nitride insulating film 113 are as follows: therefractive index that is greater than or equal to 1.95 to light having awavelength of 633 nm when measured by spectroscopic ellipsometry, andthe film density is greater than or equal to 2.75 g/cn³ when measured byX-ray reflectometry. It is preferable that the hydrogen concentration ofthe second nitride insulating film 113 be higher than or equal to 10atomic % and lower than or equal to 15 atomic % when measured byRutherford backscattering spectrometry.

In general, as a formed film becomes denser, the refractive index of thefilm is increased and the etching rate of the film is reduced.Accordingly, by forming the second nitride insulating film 113 using anitride insulating film having a refractive index and an etching rate inthe above ranges, the second nitride insulating film 113 can be a densefilm, so that the second nitride insulating film 113 can exhibit abarrier property against hydrogen. Further, as a formed film becomesdenser, the density of the film is increased; therefore, in order thatthe second nitride insulating film 113 can sufficiently exhibit abarrier property against hydrogen, the second nitride insulating film113 is preferably formed using a nitride insulating film having adensity in the above range. In this manner, as the concentration ofhydrogen contained in the nitride insulating film becomes lower, thenitride insulating film becomes less likely to release hydrogen, so thatthe nitride insulating film exhibits a barrier property againsthydrogen. A silicon nitride film, a silicon nitride oxide film, and thelike can be given as examples of the nitride insulating film.

Since the second nitride insulating film 113 is provided, hydrogen whichexists in a portion located below the transistor 109 and including thefirst nitride insulating film 111 can be prevented from diffusing intothe oxide semiconductor film (at least the channel formation) of thetransistor 109 as an impurity; as a result, change in the electricalcharacteristics of the transistor 109 can be prevented. Accordingly, theelectrical characteristics of the transistor 109 can be favorable andthe reliability of the semiconductor device can be improved.

Next, more details of the semiconductor device that is one embodiment ofthe present invention are described.

In the semiconductor device illustrated in FIG. 1A, channel formationregions of the transistor 101 and the transistor 103 can be formed in asubstrate 115 including a semiconductor material (in a bulk) or over thesubstrate 115 including a semiconductor material. Note that in thisembodiment, a single crystal silicon substrate having p-typeconductivity is used as the substrate 115, and the channel formationregions of the transistors 101 and 103 are formed in the substrate 115.

The transistor 101 includes a channel formation region 117 which isprovided in the substrate 115; impurity regions 119 between which thechannel formation region 117 is sandwiched and high-concentrationimpurity regions 121 which are electrically connected to the impurityregions 119 (these regions are also simply referred to as impurityregions collectively); a gate insulating film 123 which is provided overthe channel formation region 117; a gate electrode 125 which is providedover the gate insulating film 123; sidewalls 129 which are provided onside surfaces of the gate electrode 125; and a source or drain electrode(hereinafter referred to an electrode 131) which is provided in contactwith the high-concentration impurity region 121 provided on one side ofthe channel formation region 117.

The impurity regions 119 function as lightly doped drain (LDD) regionsor extension regions. The high-concentration impurity regions 121function as a source region and a drain region of the transistor 101.

The transistor 103 is provided on an n-well 133 which is formed byaddition of an impurity element imparting n-type conductivity to thesubstrate 115. The transistor 103 includes a channel formation region135 which is provided in the n-well 133; impurity regions 137 betweenwhich the channel formation region 135 is sandwiched andhigh-concentration impurity regions 139 which are electrically connectedto the impurity regions 137 (these regions are also simply referred toas impurity regions collectively); a gate insulating film 141 which isprovided over the channel formation region 135; a gate electrode 143which is provided over the gate insulating film 141; sidewalls 145 whichare provided on side surfaces of the gate electrode 143; and a source ordrain electrode (hereinafter referred to an electrode 147) which iselectrically connected to the impurity region 137 on one side of thechannel formation region 135 and provided in contact with thehigh-concentration impurity region 139.

The impurity regions 137 function as lightly doped drain (LDD) regionsor extension regions. The high-concentration impurity regions 139function as a source region and a drain region of the transistor 103.

In the semiconductor device illustrated in FIG. 1A, an electrode 149 isprovided in contact with the high-concentration impurity region 121 onthe other side of the channel formation region 117 in the transistor 101and the high-concentration impurity region 139 on the other side of thechannel formation region 135 in the transistor 103. The electrode 149functions as a source or drain electrode of the transistor 101 andfunctions as a source or drain electrode of the transistor 103. Further,the transistor 101 and the transistor 103 are electrically connected toeach other with the electrode 149 to form the CMOS circuit 105.

Element isolation insulating films 151 are provided over the substrate115 to surround each of the transistors 101 and 103. An insulating film153 is provided to cover the transistors 101 and 103 and the elementisolation insulating films 151, and the first nitride insulating film111 is provided over the insulating film 153.

An interlayer insulating film 155 is provided over the first nitrideinsulating film 111. Note that the electrode 131, the electrode 147, andthe electrode 149 are provided to penetrate the insulating film 153, thefirst nitride insulating film 111, and the interlayer insulating film155 and each function as a wiring.

An interlayer insulating film 157 is provided over the interlayerinsulating film 155. An electrode 159 is provided over the interlayerinsulating film 157. The electrode 159 also functions as a wiring. Theelectrode 159 is electrically connected to a gate wiring (notillustrated) of the transistors 101 and 103 (the CMOS circuit 105)through an opening which is formed in the insulating film 153, the firstnitride insulating film 111, the interlayer insulating film 155, and theinterlayer insulating film 157. The gate wiring is provided over thegate insulating film 123 and the gate insulating film 141 and branchesto be the gate electrode 125 of the transistor 101 and the gateelectrode 143 of the transistor 103. Therefore, the CMOS circuit 105 andthe capacitor 107 are electrically connected to each other, and thecapacitor 107 and the transistor 109 are electrically connected to eachother.

An interlayer insulating film 161 is provided over the electrode 159 andthe interlayer insulating film 157. An electrode 163 is provided incontact with the electrode 159 through an opening formed in theinterlayer insulating film 161. An electrode 165 and an electrode 167are provided over the interlayer insulating film 161. The electrode 165is provided over a region of the interlayer insulating film 161 whichoverlaps with an oxide semiconductor film 173 of the transistor 109. Theelectrode 167 is provided to overlap with a drain electrode 177 of thetransistor 109. Note that the electrode 163, the electrode 165, and theelectrode 167 each also function as a wiring.

An insulating film 169 is provided between the electrodes 163, 165, and167. The electrodes 163, 165, and 167 and the insulating film 169 areplanarized.

The second nitride insulating film 113 is provided over the electrodes163, 165, and 167 and the insulating film 169. An insulating film 171 isprovided over the second nitride insulating film 113.

The capacitor 107 and the transistor 109 are provided over theinsulating film 171.

The transistor 109 includes at least the oxide semiconductor film 173which is provided over the insulating film 171, a source electrode 175and the drain electrode 177 which are provided in contact with the oxidesemiconductor film 173, a gate insulating film 179 which is providedover the oxide semiconductor film 173, the source electrode 175, and thedrain electrode 177, and a gate electrode 181 which is provided over thegate insulating film 179 to overlap with the oxide semiconductor film173.

The source electrode 175 is in contact with the electrode 163 via aconnection electrode 172 which is provided in an opening formed in thesecond nitride insulating film 113 and the insulating film 171.Therefore, the source electrode 175 is electrically connected to thegate electrode 125 of the transistor 101 and the gate electrode 143 ofthe transistor 103.

The drain electrode 177 is in contact with the electrode 167 via theconnection electrode 172 provided in an opening formed in the secondnitride insulating film 113 and the insulating film 171.

An electrode 183 is provided over a region of the gate insulating film179 which overlaps with the source electrode 175. In the capacitor 107,the source electrode 175 serves as one electrode, the gate insulatingfilm 179 serves as a dielectric, and the electrode 183 serves as theother electrode. Note that the electrode 183 also functions as a wiring.

When the source electrode 175 of the transistor 109 is used as oneelectrode of the capacitor 107, the degree of integration of thesemiconductor device can be increased.

An insulating film 185 is provided over the gate insulating film 179,the gate electrode 181, and the electrode 183.

In the transistor 109, the oxide semiconductor film 173 is formed usingan amorphous oxide semiconductor, a single crystal oxide semiconductor,or a polycrystalline oxide semiconductor.

It is preferable that impurities such as hydrogen be sufficientlyremoved from the oxide semiconductor film 173 so that the oxidesemiconductor film 173 is highly purified. Specifically, theconcentration of hydrogen of the oxide semiconductor film 173, which ismeasured by secondary ion mass spectrometry (SIMS), is lower than 5×10¹⁸atoms/cm³, preferably lower than or equal to 1×10¹⁸ atoms/cm³, furtherpreferably lower than or equal to 5×10¹⁷ atoms/cm³, still furtherpreferably lower than or equal to 1×10¹⁶ atoms/cm³. Hydrogen containedin the oxide semiconductor film 173 reacts with oxygen bonded to a metalatom to generate water, and a defect is formed in a lattice from whichoxygen is released (or a portion from which oxygen is removed). Bondingof part of hydrogen to oxygen might generate carriers, which might leadto an increase in off-state current of the transistor 109.

The concentration of an alkali metal or an alkaline earth metal of theoxide semiconductor film 173 is lower than or equal to 1×10¹⁸ atoms/cm³,preferably lower than or equal to 2×10¹⁶ atoms/cm³, when measured bysecondary ion mass spectrometry. This is because bonding of an alkalimetal and an alkaline to an oxide semiconductor might generate carriers,which might lead to an increase in off-state current of the transistor109. The nitrogen concentration of the oxide semiconductor film 173 ispreferably lower than or equal to 5×10¹⁸ atoms/cm³.

In this manner, when impurities in the oxide semiconductor film 173 arereduced as much as possible to highly purify the oxide semiconductorfilm 173, leakage current of the transistor 109 can be extremelyreduced. Further, change in (negative shift of) the threshold voltage ofthe transistor 109 can be reduced. Accordingly, a semiconductor devicehaving favorable electrical characteristics can be manufactured.Further, a semiconductor device with improved reliability can bemanufactured.

Note that various examinations can prove low off-state current of atransistor including a highly purified oxide semiconductor film in whicha channel formation region is formed. For example, even when an elementhas a channel width (W) of 1×10⁶ μm and a channel length (L) of 10 mm,off-state current can be less than or equal to the measurement limit ofa semiconductor parameter analyzer, i.e., less than or equal to 1×10⁻¹³A, at a voltage (drain voltage) between the source electrode and thedrain electrode of from 1 V to 10 V. In this case, it can be found thatthe off-state current corresponding to a value obtained by dividing theoff-state current by the channel width of the transistor is 100 zA/μm orlower. Further, the off-state current was measured with the use of acircuit in which a capacitor and a transistor are connected to eachother and charge that flows in or out from the capacitor is controlledby the transistor. In the measurement, the off-state current of thetransistor was measured from change in the amount of electrical chargeof the capacitor per unit hour with the use of the transistor. As aresult, it is found that in the case where the voltage between thesource electrode and the drain electrode of the transistor is 3 V, loweroff-state current of several tens of yoctoamperes per micrometer (yA/μm)can be obtained. Accordingly, a transistor including a highly purifiedoxide semiconductor film in which a channel formation region is formedhas remarkably low off-state current.

Oxygen vacancies which are included in an oxide semiconductor mightgenerate carriers, which might lower the electrical characteristics andreliability of the transistor. Thus, it is preferable that oxygenvacancies in the oxide semiconductor film 173 be reduced as much aspossible. For example, the spin density of the oxide semiconductor film173 (the density of oxygen vacancies in the oxide semiconductor film173) at a g-value of 1.93 in electron spin resonance in which a magneticfield is applied in parallel to the film surface is preferably reducedto be lower than or equal to the lower limit of detection of themeasurement instrument. By reducing the oxygen vacancies as much aspossible, change in (negative shift of) the threshold voltage of thetransistor 109 can be reduced, so that the electrical characteristicsand reliability of the semiconductor device can be improved.

FIG. 2 illustrates a top view of part of the semiconductor device thatis one embodiment of the present invention. The cross-sectional view inFIG. 1A corresponds to a cross-sectional view taken along a dasheddotted line X-Y in the top view in FIG. 2. In the top view in FIG. 2,some components (e.g., the CMOS circuit 105, the first nitrideinsulating film 111, the second nitride insulating film 113, and othergate insulating films and interlayer insulating films) are notillustrated for clarification of the drawing.

<Method for Manufacturing Semiconductor Device>

Next, the semiconductor device that is one embodiment of the presentinvention and a method for manufacturing the semiconductor device aredescribed with reference to drawings. In the following description,first, a method for manufacturing the transistors included in the CMOScircuit in the lower portion is described, and then, a method formanufacturing the transistor including an oxide semiconductor in theupper portion is described.

The substrate 115 used for the semiconductor device is a substratecontaining a silicon semiconductor.

First, the substrate 115 containing a semiconductor material isprepared. As the substrate 115, a single crystal semiconductor substrateor a polycrystalline semiconductor substrate made of silicon or siliconcarbide, a compound semiconductor substrate made of silicon germanium orthe like, a silicon on insulator (SOI) substrate, or the like can beused. The channel formation regions of the transistor 101 and thetransistor 103 can be formed in the semiconductor substrate (in thebulk) or over the semiconductor substrate.

In the semiconductor device described in this embodiment, a singlecrystal silicon substrate is used as the substrate 115, and thetransistor 101 and the transistor 103 are provided on the single crystalsilicon substrate. In other words, in this embodiment, a siliconsemiconductor used as the first semiconductor material is single crystalsilicon, and the channel formation regions of the transistors 101 and103 are formed using single crystal silicon. Note that this embodimentshows an example in which a single crystal silicon substrate havingp-type conductivity is used as the substrate 115.

An impurity element imparting n-type conductivity is added to a regionof the substrate 115 where the transistor 103 is to be formed, so thatthe n-well 133 is formed in the region. The channel formation region 135of the transistor 103 is formed in the n-well 133. As the impurityelement imparting n-type conductivity, phosphorus (P), arsenic (As), orthe like can be used.

Note that an impurity element imparting p-type conductivity is not addedto a formation region of the transistor 101 that is an n-channeltransistor; however, a p-well may be formed by addition of an impurityelement imparting p-type conductivity. As the impurity element impartingp-type conductivity, boron (B), aluminum (Al), gallium (Ga), or the likecan be used.

In the case where a single crystal silicon substrate having n-typeconductivity is used, a p-well may be formed by addition of an impurityelement imparting p-type conductivity, and the channel formation region135 of the transistor 101 can be formed in the p-well.

The n-well 133 or the p-well can be formed by addition of any of theabove-described impurity elements by an ion doping method, an ionimplantation method, or the like.

The element isolation insulating films 151 are formed over the substrate115. The element isolation insulating films 151 can be formed by a knownmethod. For example, a protective film is formed over the substrate 115and etched using the protective film as a mask to remove portions of thesubstrate 115 that are regions which are not covered with the protectivefilm (exposed regions), whereby recessed portions are formed. For theetching treatment, dry etching is preferably performed, but wet etchingmay be performed. An etching gas and an etchant can be selected asappropriate depending on a material of a layer to be etched. Then, aninsulating film is formed to cover the substrate 115 and the insulatingfilm which are formed in regions except the recessed portions areselectively removed, whereby the element isolation insulating films 151can be formed. The insulating film is formed using a silicon oxide film,a silicon nitride film, a silicon nitride oxide film, or the like.Polishing treatment such as chemical mechanical polishing (CMP), etchingtreatment, and the like can be given as examples of a way to remove theinsulating film, and any of them may be used. Note that the protectivefilm is removed after the recessed portions are formed or after theelement isolation insulating films 151 are formed. Further, after thepolishing treatment such as CMP or the etching treatment, cleaningtreatment is performed and heat treatment for removing moisture attachedonto a surface of the processing substrate is performed.

Note that also in the subsequent process of the semiconductor deviceafter the formation of the element isolation insulating films 151, thecleaning treatment and the heat treatment are performed after polishingtreatment such as CMP or etching treatment is performed.

Note that the element isolation insulating films 151 can also be formedusing an element isolation technique such as local oxidation of silicon(LOCOS).

Next, an insulating film to be processed into the gate insulating film123 and the gate insulating film 141 later is formed over the substrate115 where the element isolation insulating films 151 are formed. Then afilm containing a conductive material (conductive film) is formed overthe insulating film and processed, so that the gate electrode 125 andthe gate electrode 143 are formed. The insulating film processed intothe gate insulating films 123 and 141 is formed with a single-layerstructure or a stacked-layer structure including one or more of thefollowing films and the like formed by a CVD method, a sputteringmethod, or the like: a silicon oxide film, a hafnium oxide film, analuminum oxide film, a tantalum oxide film, a silicon nitride film, anda silicon nitride oxide film. Alternatively, the insulating filmprocessed into the gate insulating films 123 and 141 may be formed insuch a manner that the surface of the substrate 115 is oxidized ornitrided by high-density plasma treatment or thermal oxidationtreatment. The high-density plasma treatment can be performed using, forexample, a mixed gas of a rare gas such as He, Ar, Kr, or Xe and a gassuch as oxygen, nitrogen oxide, ammonia, nitrogen, or hydrogen. Althoughthere is no particular limitation on the thickness of the insulatingfilm, the insulating film can have a thickness greater than or equal to1 nm and less than or equal to 100 nm, for example.

There is no particular limitation on the conductive film processed intothe gate electrodes 125 and 143, and a variety of conductive films areapplicable thereto. For example, a metal material such as aluminum,copper, titanium, tantalum, or tungsten can be used. Alternatively, thefilm containing a conductive material may be formed using asemiconductor material such as polycrystalline silicon containing aconductive material. There is no particular limitation on the method forforming the film containing a conductive material, and a variety offormation methods such as an evaporation method, a CVD method, asputtering method, or a spin coating method can be employed. Note thatthe conductive film is formed using a metal material in this embodiment.The insulating film and the conductive film can be processed by dryetching or wet etching. Note that there is no particular limitation onthe thickness of the conductive film, and the thickness of theconductive film can be determined in consideration of time needed forthe formation, desired resistivity, or the like.

Next, a protective film is formed over a region where the transistor 101is to be formed, and an impurity element imparting p-type conductivityis added to a region where the transistor 103 is to be formed, using thegate electrode 143 as a mask, so that impurity regions are formed.Further, a protective film is formed over the region where thetransistor 103 is to be formed, and an impurity element imparting n-typeconductivity is added to the region where the transistor 101 is to beformed, using the gate electrode 125 as a mask, so that impurity regionsare formed. Note that by the formation of the impurity regions, a regionof the substrate 115 which is located below the gate electrode 125serves as the channel formation region 117 of the transistor 101 (seeFIG. 3A). The concentration of the added impurity can be set asappropriate; the concentration is preferably raised in accordance withthe degree of miniaturization of the semiconductor element.Alternatively, an insulating film may be formed to cover the gateelectrode 125 and the gate electrode 143 and the impurity element may beadded through the insulating film.

Next, the sidewalls 129 and 145 are formed. An insulating film is formedso as to cover the gate electrode 125 and the gate electrode 143 andthen subjected to highly anisotropic etching, whereby the sidewalls 129and 145 can be formed in a self-aligned manner. Note that the gateinsulating films 123 and 141 are formed at the same time as theformation of the sidewalls 129 and 145.

Next, the insulating film 153 is formed to cover the gate electrodes 125and 143, the impurity regions, the sidewalls 129 and 145, and the like.Then, a protective film is formed over a region of the insulating film153 where the transistor 103 is to be formed, and an impurity elementimparting n-type conductivity is added to the impurity regions using thegate electrode 125 and the sidewalls 129 as masks, whereby the impurityregions 119 and the high-concentration impurity regions 121 are formed.Further, a protective film is formed over a region of the insulatingfilm 153 where the transistor 101 is to be formed, and an impurityelement imparting p-type conductivity is added using the gate electrode143 and the sidewalls 145 as masks, whereby the impurity regions 137 andthe high-concentration impurity regions 139 are formed. Note that theimpurity element may be added before the insulating film 153 is formed,and then the insulating film 153 may be formed.

Note that the semiconductor device that is one embodiment of the presentinvention is not limited to the one illustrated in FIGS. 1A and 1B. Forexample, transistors including silicide or transistors without sidewallsmay be used as the transistors 101 and 103. When a structure thatcontains silicide is used, the resistance of a source region and a drainregion can be further lowered and the operation speed of thesemiconductor device can be increased. Further, the semiconductor devicecan be operated at low voltage; thus, power consumption of thesemiconductor device can be reduced. Examples of a metal material withwhich silicide can be formed include titanium, tantalum, tungsten,nickel, cobalt, platinum, and the like.

Next, the first nitride insulating film 111 is formed over theinsulating film 153. It is preferable that the first nitride insulatingfilm 111 have such a thickness that the first nitride insulating film111 contains hydrogen enough to sufficiently perform hydrogenationtreatment on at least the channel formation regions 117 and 135 of thetransistors 101 and 103. For example, the thickness of the first nitrideinsulating film 111 is greater than or equal to 50 nm and less than orequal to 1000 nm, preferably greater than or equal to 100 nm and lessthan or equal to 500 nm. The structure obtained through the above stepsis illustrated in FIG. 3A.

Here, a method for forming the first nitride insulating film 111 isdescribed. The first nitride insulating film 111 is formed of aninsulating nitride film which contains hydrogen and releases hydrogen byheating. A silicon nitride film or a silicon nitride oxide film which isapplicable to the first nitride insulating film 111 can be formed on thefollowing conditions. The substrate placed in a treatment chamber of aplasma CVD apparatus, which is vacuum-evacuated, is held at atemperature higher than or equal to 300° C. and lower than or equal to400° C., preferably higher than or equal to 320° C. and lower than orequal to 370° C., the pressure in the treatment chamber is set greaterthan or equal to 40 Pa and less than or equal to 600 Pa, preferablygreater than or equal to 100 Pa and less than or equal to 500 Pa byintroduction of a source gas into the treatment chamber, andhigh-frequency power is supplied to an electrode provided in thetreatment chamber. Nitrogen and a deposition gas containing silicon areused as the source gas. Alternatively, ammonia may be used as the sourcegas. Typical examples of the deposition gas containing silicon includesilane, disilane, trisilane, silane fluoride, and the like. In orderthat hydrogen is contained in the nitride insulating film formed as thefirst nitride insulating film 111, ammonia, which contains hydrogen as acomposition element, is preferably used for the source gas. For example,in the case where the first nitride insulating film 111 is formed usinga plasma CVD apparatus, the flow rate of the nitrogen supplied to thetreatment chamber which is vacuum-evacuated is set to greater than orequal to 20 times and less than or equal to 1000 times, preferablygreater than or equal to 150 times and less than or equal to 750 times,that of the deposition gas containing silicon supplied to the treatmentchamber. In the case where ammonia is used for the source gas, the flowrate of the ammonia is set to greater than or equal to 1 time and lessthan or equal to 100 times, preferably greater than or equal to 1 timeand less than or equal to 50 times, that of the deposition gascontaining silicon.

Heat treatment is performed after the first nitride insulating film 111is formed, whereby defects included in at least the channel formationregions 117 and 135 of the transistors 101 and 103 are repaired(terminated with hydrogen). By the heat treatment, defects in the gateinsulating film 123 and the gate insulating film 141, defects at aninterface between the gate insulating film 123 and the silicon, and thelike can be repaired. In other words, it is possible to subject thesemiconductor device that is this embodiment to hydrogenation treatmentby forming the first nitride insulating film 111 and performing the heattreatment.

The heat treatment apparatus in the heat treatment is not limited to anelectric furnace; the heat treatment apparatus can be an apparatus thatheats an object using thermal conduction or thermal radiation given by amedium such as a heated gas or the like. For example, an RTA (rapidthermal anneal) apparatus such as a GRTA (gas rapid thermal anneal)apparatus or an LRTA (lamp rapid thermal anneal) apparatus can be used.An LRTA apparatus is an apparatus for heating an object to be processedby radiation of light (an electromagnetic wave) emitted from a lamp suchas a halogen lamp, a metal halide lamp, a xenon arc lamp, a carbon arclamp, a high pressure sodium lamp, or a high pressure mercury lamp. AGRTA apparatus is an apparatus for heat treatment using ahigh-temperature gas. In the heat treatment, treatment time and atreatment atmosphere can be selected as appropriate. Note that the heattreatment may be performed any time after the first nitride insulatingfilm 111 is formed, and the timing of the heat treatment can be selectedas appropriate. Further, for example, the heat treatment may also servesas other heat treatment, like heat treatment which is to be performedfor forming an interlayer insulating film or the transistor 109.

Next, the interlayer insulating film 155 is formed over the firstnitride insulating film 111, and then the electrode 131, the electrode147, and the electrode 149 are formed (see FIG. 3B). The electrode 131,the electrode 147, and the electrode 149 can be formed in such a mannerthat the insulating film 153, the first nitride insulating film 111, andthe interlayer insulating film 155 are processed to form openingsreaching the high-concentration impurity regions 121 and thehigh-concentration impurity regions 139, and then a conductive film isformed in and over the openings and processed by etching treatment orthe like. Note that the surface of the interlayer insulating film 155 ispreferably planarized by polishing treatment such as CMP or etchingtreatment before the openings are formed.

The interlayer insulating film 155 can be formed in such a manner thatan inorganic insulating film or an organic insulating film is formed andprocessed. Examples of the inorganic insulating film include a siliconoxide film, a silicon oxynitride film, an aluminum oxide film, and thelike. Examples of the organic insulating film include films of anacrylic resin, polyimide, a benzocyclobutene-based resin, polyamide, anepoxy resin, a siloxane-based resin, and the like. Note that theinterlayer insulating film 155 may be a stack of two or more of theseinsulating films. There is no particular limitation on the method forforming the inorganic insulating film or the organic insulating film andthe method may be selected as appropriate in accordance with thematerial to be used. For example, a CVD method, a sputtering method,spin coating, dipping, spray coating, a droplet discharge method (suchas an inkjet method), screen printing, offset printing, or the like canbe employed.

In the case where miniaturization of a semiconductor element such as atransistor included in a semiconductor device is advanced, parasiticcapacitance between wirings is significant and thus signal delay isincreased. Therefore, the dielectric constant of silicon oxide (k=4.0 to4.5) is too high and thus a material with k=3.0 or less is preferablyused for forming the interlayer insulating film 155. Further, mechanicalstrength is required for the interlayer insulating film 155 becauseplanarization is to be performed thereon. The insulating film 155 can bemade porous to have a lower dielectric constant as long as themechanical strength can be secured.

The electrode 131, the electrode 147, and the electrode 149 preferablyhave a structure in which part of the electrodes is embedded in theinterlayer insulating film 155, the first nitride insulating film 111,and the insulating film 153, like a damascene structure. There is noparticular limitation on the material of the electrode 131, theelectrode 147, and the electrode 149 and a variety of conductivematerials can be used. For example, a metal material such as molybdenum,titanium, chromium, tantalum, tungsten, aluminum, copper, neodymium, orscandium can be used.

Note that in the case where the electrodes 131, 147, and 149 are formed,the process is preferably performed so that the surfaces thereof areplanarized. For example, when a thin titanium film or a thin titaniumnitride film is formed in a region including the openings and then atungsten film is formed so as to be embedded in the openings, an excesstungsten film, an excess titanium film, an excess titanium nitride film,or the like is removed and the planarity of the surface can be improvedby the subsequent CMP.

Next, the interlayer insulating film 157 is formed over the interlayerinsulating film 155, the electrode 131, the electrode 147, and theelectrode 149. An opening reaching the gate electrode 125 and the gateelectrode 143 is formed in the interlayer insulating film 157 (notillustrated), and the electrode 159 is formed in and over the opening.Then, the interlayer insulating film 161 is formed over the interlayerinsulating film 157 and the electrode 159 (see FIG. 3C).

The interlayer insulating film 157 and the interlayer insulating film161 can be formed using a material which is applicable to the interlayerinsulating film 155 in a manner similar to that of the interlayerinsulating film 155. The electrode 159 can be formed using a materialwhich is applicable to the electrode 131 or the like in a manner similarto that of the electrode 131 or the like.

Next, an opening reaching the electrode 159 is formed in the interlayerinsulating film 161 and the electrode 163 is formed in and over theopening. The electrode 165 and the electrode 167 can be formed at thesame time as the formation of the electrode 163. Then, the insulatingfilm 169 which fills spaces between the electrode 163, the electrode165, and the electrode 167 is formed. After that, the second nitrideinsulating film 113 is formed over the electrodes 163, 165, and 167 andthe insulating film 169 (see FIG. 4A).

The electrode 163, the electrode 165, and the electrode 167 can beformed using a material which is applicable to the electrode 131 or thelike in a manner similar to that of the electrode 131 or the like. Theinsulating film 169 can be formed using a material which is applicableto the interlayer insulating film 155. Further, the insulating film 169can be formed through a process similar to that of the interlayerinsulating film 155 and through polishing treatment such as CMP oretching treatment. The polishing treatment such as CMP or etchingtreatment is performed until surfaces of the electrode 163, theelectrode 165, and the electrode 167 are exposed.

A method for forming the second nitride insulating film of oneembodiment of the present invention is described below. The secondnitride insulating film 113 is formed of a dense nitride insulating filmwhich has a low hydrogen content. A silicon nitride film or a siliconnitride oxide film which is applicable to the second nitride insulatingfilm 113 can be formed on the following conditions. The substrate placedin a treatment chamber of a plasma CVD apparatus, which isvacuum-evacuated, is held at a temperature higher than or equal to 300°C. and lower than or equal to 400° C., preferably higher than or equalto 320° C. and lower than or equal to 370° C., the pressure in thetreatment chamber is set greater than or equal to 20 Pa and less than orequal to 200 Pa, preferably greater than or equal to 30 Pa and less thanor equal to 100 Pa by introduction of a source gas into the treatmentchamber, and high-frequency power is supplied to an electrode providedin the treatment chamber. At least nitrogen and a deposition gascontaining silicon are preferably used as the source gases of the secondnitride insulating film 113. Typical examples of the deposition gascontaining silicon include silane, disilane, trisilane, and silanefluoride. In order that hydrogen is contained as little as possible inthe nitride insulating film formed as the second nitride insulating film113, ammonia, which contains hydrogen as a composition element, is notused for the source gas or a small amount of ammonia is used. Forexample, in the case where the second nitride insulating film 113 isformed using a plasma CVD apparatus, the flow rate of the nitrogensupplied to the treatment chamber which is vacuum-evacuated is set togreater than or equal to 10 times and less than or equal to 100 times,preferably greater than or equal to 15 times and less than or equal to40 times, that of the deposition gas containing silicon supplied to thetreatment chamber. The flow rate of the ammonia is greater than or equalto 0.1 times and less than 1 time, preferably greater than or equal to0.2 times and less than or equal to 0.75 times, that of the depositiongas containing silicon.

The use of ammonia as the source gas promotes decomposition of thedeposition gas containing silicon and nitrogen. This is because ammoniais dissociated by plasma energy or heat energy, and energy generated bythe dissociation contributes to decomposition of a bond of thedeposition gas molecules containing silicon and a bond of nitrogenmolecules. Accordingly, a silicon nitride film which is less likelytransmit hydrogen and functions as a bather film against hydrogen can beformed.

The second nitride insulating film 113 preferably has a thickness enoughto exhibit a sufficient barrier property against hydrogen which isdiffused from a portion below the transistor 109 into the oxidesemiconductor film 173 of the transistor 109. For example, the secondnitride insulating film 113 has a thickness greater than or equal to 5nm and less than or equal to 100 nm, preferably greater than or equal to15 nm and less than or equal to 50 nm.

In the case where the second nitride insulating film 113 is formed of asilicon nitride film which is formed using silane, nitrogen, and ammoniaas source gases, an increase in thickness of the second nitrideinsulating film 113 can lead to an improvement in resistance againstESD. For example, the withstand voltage can be 300 V or more when thethickness of the second nitride insulating film 113 is greater than orequal to 300 nm and less than or equal to 400 nm. An improving inresistance against ESD leads to an improvement in yield of thesemiconductor device.

When tungsten is used for the electrodes 163, 165, and 167 in thesemiconductor device, oxygen which is contained in the insulating film171 to be formed later diffuses into the electrodes 163, 165, and 167,and thus there is a possibility that oxygen vacancies of the oxidesemiconductor film 173 to be formed later are not reduced adequately.Since the second nitride insulating film 113 functions as a barrier filmagainst hydrogen, the second nitride insulating film 113 is less likelyto transmit hydrogen. Further, the second nitride insulating film 113 isalso less likely to transmit oxygen, which has a larger atomic radiusthan hydrogen. Therefore, the second nitride insulating film 113 canprevent oxygen contained in the insulating film 171 from diffusing intothe electrodes 163, 165, and 167; thus, oxygen vacancies of the oxidesemiconductor film 173 can be sufficiently reduced.

The electrode 165 can also function as a back gate electrode byapplication of voltage. For example, when the potential is set to GND(or a fixed potential), the electrical characteristics of the transistor109 to be formed later can be controlled. The electrode 165 has afunction of preventing static electricity. Note that in the case wherethe threshold voltage of the transistor 109 is not required to becontrolled by the electrode 165 in order to make the transistor 109 be anormally-off transistor, the electrode 165 is not necessarily provided.In the case where the transistor 109 is used for part of a particularcircuit and a problem might be caused by providing the electrode 165,the electrode 165 is not necessarily provided in the circuit.

Subsequently, the insulating film 171 and the connection electrode 172are formed over the second nitride insulating film 113. Then, an oxidesemiconductor film 174 is formed over the insulating film 171 and theconnection electrode 172 (see FIG. 4B).

In order that the insulating film 171 functions as a base insulatingfilm of the transistor 109 and reduces oxygen vacancies contained in theoxide semiconductor film 173 to be formed later, an insulating filmcontaining oxygen is preferably formed as the insulating film 171. Forexample, the insulating film 171 is formed by a CVD method or asputtering method using one insulating film or a stack of insulatingfilms selected from the following: an oxide insulating film such as asilicon oxide film, a gallium oxide film, a hafnium oxide film, anyttrium oxide film, or an aluminum oxide; an oxynitride insulating filmsuch as a silicon oxynitride film or an aluminum oxynitride film; and anitride oxide insulating film such as a silicon nitride oxide film.

The connection electrode 172 can be formed using a material which isapplicable to the electrode 131 in a manner similar to the electrode131. Note that in the case where the insulating film 171 is formed byperforming polishing treatment such as CMP or etching treatment on aformed interlayer insulating film, the polishing treatment or theetching treatment is performed until a surface of the connectionelectrode 172 is exposed.

In particular, the insulating film 171 preferably includes a regioncontaining oxygen in excess of that in the stoichiometric composition(the region is referred to as an oxygen excess region). This is becauseby including the oxygen-excess region at least in a region in contactwith the oxide semiconductor film 173 to be formed later, the insulatingfilm 171 can supply oxygen to the oxide semiconductor film 174 (or theoxide semiconductor film 173); thus, it is possible that oxygencontained in the insulating film 171 moves to the oxide semiconductorfilm 174 and the oxygen vacancies are filled. To provide theoxygen-excess region in the insulating film 171, the insulating film 171may be formed in such a manner that an oxide insulating film is formedin an oxygen atmosphere by a CVD method or a sputtering method.Alternatively, the oxygen-excess region may be formed in such a mannerthat oxygen is introduced after the insulating film 171 is formed.

The insulating film 171 may be an oxide insulating film which containsoxygen in excess of that in the stoichiometric composition. For example,in the case where the number of oxygen molecules released from an oxideinsulating film which is used as the insulating film 171 is greater thanor equal to 1.0×10¹⁸ molecules/cm³ when measured by TDS, at least someof the oxygen vacancies contained in the oxide semiconductor film 174can be filled.

The oxide semiconductor film 174 preferably contains at least indium(In) or zinc (Zn). In particular, In and Zn are preferably contained. Inaddition, as a stabilizer for reducing variation in electriccharacteristics of the transistor using the oxide semiconductor, one ormore selected from gallium (Ga), tin (Sn), hafnium (Hf), zirconium (Zr),titanium (Ti), scandium (Sc), yttrium (Y), and an lanthanoid (such ascerium (Ce), neodymium (Nd), or gadolinium (Gd), for example) ispreferably contained.

As the oxide semiconductor, for example, any of the following can beused: indium oxide; tin oxide; zinc oxide; an oxide containing two kindsof metals, such as an In—Zn-based oxide, an Sn—Zn-based oxide, anAl—Zn-based oxide, a Zn—Mg-based oxide, an Sn—Mg-based oxide, anIn—Mg-based oxide, or an In—Ga-based oxide; an oxide containing threekinds of metals, such as an In—Ga—Zn-based oxide (also referred to asIGZO), an In—Al—Zn-based oxide, an In—Sn—Zn-based oxide, anSn—Ga—Zn-based oxide, an Al—Ga—Zn-based oxide, an Sn—Al—Zn-based oxide,an In—Hf—Zn-based oxide, an In—Zr—Zn-based oxide, an In—Ti—Zn-basedoxide, an In—Sc—Zn-based oxide, an In—Y—Zn-based oxide, anIn—La—Zn-based oxide, an In—Ce—Zn-based oxide, an In—Pr—Zn-based oxide,an In—Nd—Zn-based oxide, an In—Sm—Zn-based oxide, an In—Eu—Zn-basedoxide, an In—Gd—Zn-based oxide, an In—Tb—Zn-based oxide, anIn—Dy—Zn-based oxide, an In—Ho—Zn-based oxide, an In—Er—Zn-based oxide,an In—Tm—Zn-based oxide, an In—Yb—Zn-based oxide, or an In—Lu—Zn-basedoxide; an oxide containing four kinds of metals, such as anIn—Sn—Ga—Zn-based oxide, an In—Hf—Ga—Zn-based oxide, anIn—Al—Ga—Zn-based oxide, an In—Sn—Al—Zn-based oxide, anIn—Sn—Hf—Zn-based oxide, or an In—Hf—Al—Zn-based oxide.

Here, an “In—Ga—Zn-based oxide” means an oxide containing In, Ga, and Znas its main components and there is no particular limitation on theratio of In:Ga:Zn. The In—Ga—Zn-based oxide may contain a metal elementother than the In, Ga, and Zn.

Alternatively, a material represented by 1 nMO₃(ZnO)_(m) (m>0 issatisfied, and m is not an integer) may be used as an oxidesemiconductor. Note that M represents one or more metal elementsselected from Ga, Fe, Mn, and Co, or the above-described element as astabilizer. Alternatively, as the oxide semiconductor, a materialexpressed by a chemical formula, In₂SnO₅(ZnO)_(n) (n>0, n is a naturalnumber) may be used.

For example, an In—Ga—Zn-based oxide having an atomic ratio whereIn:Ga:Zn 1:1:1, In:Ga:Zn=1:3:2, In:Ga:Zn=3:1:2, or In:Ga:Zn=2:1:3, or anoxide whose composition is in the neighborhood of the above compositionsis preferably used as a target.

The oxide semiconductor film 174 can be formed by a sputtering method, acoating method, a printing method, a pulsed laser deposition method, alaser ablation method, or the like. Alternatively, by using a printingmethod for forming the oxide semiconductor film 174, the oxidesemiconductor film subjected to element isolation can be formeddirectly. In the case where the oxide semiconductor film is formed by asputtering method, a power supply device for generating plasma can be anRF power supply device, an AC power supply device, a DC power supplydevice, or the like as appropriate. As a sputtering gas, a rare gas(typically argon), an oxygen gas, or a mixed gas of a rare gas andoxygen is used as appropriate. In the case of using the mixed gas of arare gas and oxygen, the proportion of oxygen is preferably higher thanthat of a rare gas.

Next, a mask is formed over the oxide semiconductor film 174 and etchingtreatment is performed using the mask to form the oxide semiconductorfilm 173 (see FIG. 5A). Note that the etching treatment may be eitherwet etching or dry etching. Alternatively, the etching treatment may bea combination of dry etching and wet etching. The etching conditions(e.g., an etching gas or an etching solution, etching time, andtemperature) are set as appropriate depending on the material so thatthe oxide semiconductor film can be etched to have a desired shape.

The thickness of the oxide semiconductor film 173 is greater than orequal to 1 nm and less than or equal to 100 nm, preferably greater thanor equal to 1 nm and less than or equal to 30 nm, further preferablygreater than or equal to 1 nm and less than or equal to 50 nm, stillfurther preferably greater than or equal to 3 nm and less than or equalto 20 nm.

It is preferable that the oxide semiconductor film 173 (or the oxidesemiconductor film 174) be dehydrogenated or dehydrated by performingheat treatment before the oxide semiconductor film 173 is formed (i.e.,after the oxide semiconductor film 174 is formed) and/or after the oxidesemiconductor film 173 is formed. The temperature of the heat treatmentis typically higher than or equal to 150° C. and lower than the strainpoint of the substrate, preferably higher than or equal to 200° C. andlower than or equal to 450° C., further preferably higher than or equalto 300° C. and lower than or equal to 450° C.

The heat treatment may be performed in an atmosphere of nitrogen,oxygen, ultra-dry air (air in which the water content is 20 ppm or less,preferably 1 ppm or less, further preferably 10 ppb or less), or a raregas (argon, helium, or the like). The atmosphere of nitrogen, oxygen,ultra-dry air, or a rare gas preferably does not contain hydrogen,water, and the like. Alternatively, the heat treatment may be performedin an inert gas atmosphere first, and then in an oxygen atmosphere. Thetreatment time is 3 minutes to 24 hours.

As a heating apparatus used for the heat treatment, the heatingapparatus applicable in the heat treatment performed after the formationof the first nitride insulating film 111 can be used. With the use of anRTA apparatus, the heat treatment can be performed at a temperature ofhigher than or equal to the strain point of the substrate if the heatingtime is short. Therefore, the heat treatment time can be shortened.

The heat treatment enables not only the dehydrogenation or dehydrationof the oxide semiconductor film 173 (or the oxide semiconductor film174) but also a reduction of oxygen vacancies of the oxide semiconductorfilm 173 (or the oxide semiconductor film 174) by moving oxygen which iscontained in the insulating film 171 to the oxide semiconductor film 173(or the oxide semiconductor film 174).

As a way to reduce the oxygen vacancies in the oxide semiconductor film173, the oxide semiconductor film 173 (or the oxide semiconductor film174) may be exposed to plasma which is generated in an oxidizingatmosphere before the oxide semiconductor film 173 is formed (i.e.,after the oxide semiconductor film 174 is formed) and/or after the oxidesemiconductor film 173 is formed. Examples of the oxidizing atmosphereinclude atmospheres of oxygen, ozone, dinitrogen monoxide, and nitrogendioxide. Further, in the plasma treatment, the oxide semiconductor film173 is preferably exposed to plasma which is generated with no biasapplied to the substrate 115 side. As a result, the oxide semiconductorfilm 173 can be supplied with oxygen without being damaged; accordingly,oxygen vacancies in the oxide semiconductor film 173 can be reduced.Moreover, impurities remaining on the surface of the oxide semiconductorfilm 173 due to the etching treatment, for example, a halogen such asfluorine or chlorine, can be removed. Further, the gate insulating film179 to be formed later may be exposed to the plasma when the gateinsulating film 179 is located over the oxide semiconductor film 173.

For example, the oxide semiconductor film 173 is exposed to oxygenplasma generated in the following manner: dinitrogen monoxide isintroduced into a reaction chamber of a plasma CVD apparatus; and ahigh-frequency power of 2.5×10⁻² W/cm² is supplied to an upper electrodeprovided in the reaction chamber with a high-frequency power supply of27.12 MHz.

Next, a conductive film is formed to be in contact with at least theoxide semiconductor film 173 and the connection electrode 172. Then, amask is formed over the conductive film and etching treatment isperformed using the mask, whereby the source electrode 175 and the drainelectrode 177 are formed. Then, the gate insulating film 179 is formedto be in contact with at least the oxide semiconductor film 173, thesource electrode 175, and the drain electrode 177 (see FIG. 5B).

The source electrode 175 and the drain electrode 177 are each formedwith a single-layer structure or a stacked-layer structure including anyof metals such as aluminum, titanium, chromium, nickel, copper, yttrium,zirconium, molybdenum, silver, tantalum, and tungsten and an alloycontaining any of these metals as a main component. A single-layerstructure of an aluminum film containing silicon; a two-layer structurein which a titanium film is stacked over an aluminum film; a two-layerstructure in which a titanium film is stacked over a tungsten film; atwo-layer structure in which a copper film is formed over acopper-magnesium-aluminum alloy film; a three-layer structure in which atitanium film or a titanium nitride film, an aluminum film or a copperfilm, and a titanium film or a titanium nitride film are stacked in thisorder; and a three-layer structure in which a molybdenum film or amolybdenum nitride film, an aluminum film or a copper film, and amolybdenum film or a molybdenum nitride film are stacked in this ordercan be given as examples. Note that a transparent conductive materialcontaining indium oxide, tin oxide, or zinc oxide may be used. Asemiconductor film which is doped with an impurity element such asphosphorus and is typified by a polycrystalline silicon film, or asilicide film of nickel silicide or the like can also be used. Theconductive film can be formed by a sputtering method, a CVD method, anevaporation method, an electrolytic plating method, a printing method,an ink jet method, or the like. Note that there is no particularlimitation on the thickness of the conductive film, and the thickness ofthe conductive film can be determined in consideration of time neededfor the formation, desired resistivity, or the like.

A distance between the source electrode 175 and the drain electrode 177corresponds to a channel length L of the transistor 109. In the casewhere the channel length L of the transistor 109 is less than 50 nm, forexample, about 30 nm, a developed mask which is obtained by exposing aresist with use of an electron beam is preferably used as a mask foretching the conductive film. At a higher acceleration voltage, anelectron beam can provide a more precise pattern. The use of multipleelectron beams can shorten the process time per substrate. Here, in anelectron beam writing apparatus capable of electron beam irradiation,the acceleration voltage is preferably in the range from 5 kV to 50 kV,for example. The current intensity is preferably in the range from5×10⁻¹² A to 1×10⁻¹¹ A. The minimum beam size is preferably 2 nm orless. The minimum possible pattern line width is preferably 8 nm orless. Under the above conditions, a pattern with a width of, forexample, 30 nm or less, preferably 20 nm or less, more preferably 8 nmor less, can be obtained.

The gate insulating film 179 can be formed with a single-layer structureor a stacked-layer structure using one or more of the following films: asilicon oxide film, a gallium oxide film, a gallium oxide zinc film, aGa₂O₃ (Gd₂O₃) film, a zinc oxide film, an aluminum oxide film, a siliconnitride film, a silicon oxynitride film, an aluminum oxynitride film,and a silicon nitride oxide film. As another material of the gateinsulating film 179, an In—Ga—Zn-based oxide film having an insulatingproperty can be given. For example, the In—Ga—Zn-based oxide film havingan insulating property may be formed under the following conditions: anoxide target having an atomic ratio of In:Ga:Zn=1:3:2 is used, thesubstrate temperature is room temperature, and an argon gas or a mixedgas of argon and oxygen is used as the sputtering gas. The gateinsulating film 179 preferably includes a region containing oxygen inexcess of that in the stoichiometric composition (the region is referredto as an oxygen excess region). Like the insulating film 171, the gateinsulating film 179 may be formed using an oxide insulating film whichcontains oxygen in excess of that in the stoichiometric composition.Alternatively, the gate insulating film 179 may be formed using anitride insulating film applicable to the second nitride insulating film113. Moreover, in the case where the gate insulating film 179 is formedusing a gallium oxide film, a metal organic chemical vapor deposition(MOCVD) method can be used.

The gate insulating film 179 may be formed using an insulating film of ahigh-k material, such as a hafnium silicate (HfSiO_(x)) film, a hafniumsilicate film to which nitrogen is added (HfSi_(x)O_(y)N_(z)), a hafniumaluminate film to which nitrogen is added (HfAl_(x)O_(y)N_(z)), ahafnium oxide film, or an yttrium oxide film, so that gate leakagecurrent of the transistor 109 can be reduced.

The gate insulating film 179 can be formed by a sputtering method, a CVDmethod, an evaporation method, or the like. The thickness of the gateinsulating film 179 is greater than or equal to 5 nm and less than orequal to 400 nm, preferably greater than or equal to 10 nm and less thanor equal to 300 nm, further preferably greater than or equal to 50 nmand less than or equal to 250 nm.

After the gate insulating film 179 is formed, heat treatment may beperformed. The heat treatment can be performed in a manner similar tothat of the heat treatment for dehydrogenating or dehydrating the oxidesemiconductor film 173. The heat treatment allows oxygen contained inthe gate insulating film 179 to move to the oxide semiconductor film173, thereby reducing the oxygen vacancies included in the oxidesemiconductor film 173.

After the source electrode 175 and the drain electrode 177 are formed,cleaning treatment is preferably performed to remove an etching residue.The cleaning treatment can prevent a short circuit between the sourceelectrode 175 and the drain electrode 177. The cleaning treatment can beperformed using an alkaline solution such as a tetramethylammoniumhydroxide (TMAH) solution, an acidic solution such as a dilutedhydrofluoric acid solution or an oxalic acid solution, or water.

Next, the gate electrode 181 is formed over a region of the gateinsulating film 179 which overlaps with the oxide semiconductor film173, and the electrode 183 is formed over a region of the gateinsulating film 179 which overlaps with the source electrode 175. Thegate electrode 181 and the electrode 183 can be formed in such a mannerthat a conductive film is formed over the gate insulating film 179, amask is formed over the conductive film, and etching treatment isperformed using the mask (see FIG. 1A).

The gate electrode 181 and the electrode 183 can be formed using aconductive material applicable to the source electrode 175 and the drainelectrode 177 in a manner similar to the source electrode 175 and thedrain electrode 177.

In order to obtain a normally-off switching element, it is preferablethat the threshold voltage of the transistor be made positive byproviding a film which is formed of a material having a work function of5 eV (electron volts) or higher, preferably 5.5 eV or higher, betweenthe gate electrode 181 and the gate insulating film 179. Specifically, afilm formed of a material which has an In—N bond and a specificresistivity of 1×10⁻¹ Ω·cm to 1×10⁻⁴ Ω·cm, preferably 5×10⁻² Ω·cm to1×10⁻⁴ Ω·cm, is provided between the gate electrode 181 and the gateinsulating film 179. Examples of the material include an In—Ga—Zn-basedoxide film containing nitrogen, an In—Sn—O film containing nitrogen, anIn—Ga—O film containing nitrogen, an In—Zn—O film containing nitrogen,an In—O film containing nitrogen, and a metal nitride film (e.g., an InNfilm).

In the semiconductor device that is one embodiment of the presentinvention, the insulating film 185 may be formed over the gateinsulating film 179, the gate electrode 181, and the electrode 183. Inthe case where the transistor 109 is provided in the uppermost part inthe semiconductor device, the insulating film 185 is preferably formedusing a nitride insulating film which is applicable to the secondnitride insulating film 113. Such a structure can prevent hydrogencontained in the air (including a hydrogen compound such as water) fromentering the semiconductor device; thus, favorable electricalcharacteristic of the semiconductor device can be obtained. Further, thereliability of the semiconductor device can be improved.

After the gate insulating film 185 is formed, heat treatment may beperformed. The heat treatment can be performed in a manner similar tothat of the heat treatment for dehydrogenating or dehydrating the oxidesemiconductor film 173. The oxygen vacancies included in the oxidesemiconductor film 173 can be reduced by the heat treatment.

Through the above process, the semiconductor device that is oneembodiment of the present invention can be manufactured. In thetransistor 109 of the semiconductor device, the electrode 165 canfunction as a back gate electrode; therefore, the transistor 109 can bereferred to as a dual-gate transistor. Note that the second nitrideinsulating film 113 and the insulating film 171 serve as gate insulatingfilms for the back gate electrode.

When the electrode 165 is not provided, the transistor 109 can be atop-gate transistor. Therefore, a dual-gate transistor and a top-gatetransistor both can be manufactured over the same substrate by changingthe layout without change in the number of steps.

As in the transistor 101 and the transistor 103, sidewalls may beprovided in the transistor 109 included in the semiconductor device thatis one embodiment of the present invention. Further, a region which hashigher conductivity than the channel formation region may be provided inthe oxide semiconductor film 173. For example, by addition of animpurity, a region having high conductivity may be formed in each ofregions where the oxide semiconductor film 173 is in contact with thesource and drain electrode 175 and 177. Examples of the impurity includeboron, nitrogen, fluorine, aluminum, phosphorus, arsenic, indium, tin,antimony, helium, neon, argon, krypton, xenon, and the like. Note thatin the region having high conductivity, a region which functions as anLDD region may be formed.

The source electrode 175 and the drain electrode 177 are in contact withthe top surface of the oxide semiconductor film 173 in the transistor109 included in the semiconductor device described in this embodiment;alternatively, the source electrode 175 and the drain electrode 177 maybe in contact with the bottom surface of the oxide semiconductor film173.

The positional relation (planar layout) of the transistors included inthe semiconductor device that is one embodiment of the present inventioncan be determined as appropriate. For example, the transistors 101, 103,and 109 can be disposed so that the channel formation regions of thetransistors 101 and 103 are orthogonal to the channel formation regionof the transistor 109.

All of the interlayer insulating films that are included in thesemiconductor device of one embodiment of the present invention are notnecessarily planarized. That is, whether or not polishing treatment suchas CMP or etching treatment is performed on an interlayer insulatingfilm can be determined as appropriate.

Note that any of the transistors included in the semiconductor devicethat is one embodiment of the present invention may be a fin-typetransistor. In a fin-type structure, part of a semiconductor substrateis processed into a plate-shaped protrusion, and a gate electrode isprovided to cross the protrusion in the longitudinal direction. The gateelectrode covers top and side surfaces of the protrusion with a gateinsulating film positioned between the gate electrode and theprotrusion. When the transistor included in the semiconductor devicethat is one embodiment of the present invention has a fin-typestructure, the channel width W can be reduced to achieve higherintegration of transistors. Further, on-state current can be increased.Furthermore, control efficiency can be improved; thus, the off-statecurrent and change in the threshold voltage of the transistor can bereduced.

The transistor 101 and the transistor 103 are electrically connected tothe transistor 109 via the electrodes 159 and 163 in the semiconductordevice that is one embodiment of the present invention; alternatively,the gate electrode 125 of the transistor 101 and the gate electrode 143of the transistor 103 may be in direct contact with the source electrode175 of the transistor 109. In such a structure, the interlayerinsulating film(s) can be removed as appropriate.

In the semiconductor device that is one embodiment of the presentinvention, a semiconductor element such as a transistor may be furtherprovided over the transistor 109. In such a case, the semiconductorelement may be electrically connected to the transistor 101, thetransistor 103, or the transistor 109 as appropriate in such a mannerthat an interlayer insulating film is provided, an opening is formed inthe interlayer insulating film so as to correspond to the connectionrelation in the circuit, and an electrode is formed in the opening.

The semiconductor device that is one embodiment of the present inventionis not limited to the one corresponding to the circuit diagram in FIG.1B. The semiconductor device may have a structure which corresponds to acircuit which includes at least a transistor including a siliconsemiconductor and a transistor including an oxide semiconductor and mayhave a stacked-layer structure in which a first nitride insulating filmand a second nitride insulating film are provided between the transistorincluding a silicon semiconductor and the transistor including an oxidesemiconductor.

As described above, the semiconductor device that is one embodiment ofthe present invention is the one in which the first nitride insulatingfilm which contains hydrogen and releases hydrogen by heating isprovided over the transistors including a silicon semiconductor, and thesecond nitride insulating film which has a lower hydrogen content thanthe first nitride insulating film and functions as a barrier filmagainst hydrogen is provided between the first nitride insulating filmand the transistor including an oxide semiconductor. Since the firstnitride insulating film is provided, hydrogenation treatment can besafely and easily performed on the silicon semiconductor by heattreatment in the manufacturing process of the semiconductor device.Further, since the second nitride insulating film is provided, hydrogenwhich is released by heat treatment in the manufacturing process of thesemiconductor device can be prevented from diffusing into the oxidesemiconductor. Thus, according to one embodiment of the presentinvention, a semiconductor device having favorable electricalcharacteristics can be manufactured, and a semiconductor device havingfavorable reliability can be manufactured.

<Modification Example 1 of Semiconductor Device>

A modification example of the semiconductor device described inEmbodiment 1 is described using FIG. 6. When the electrode 163, theelectrode 165, and the electrode 167 are formed using a conductive filmwhich is less likely to transmit oxygen or formed by stacking oxidefilms having a barrier property against oxygen (e.g., a ruthenium oxidefilm), the second nitride insulating film 113 can be provided betweenthe interlayer insulating film 161 and each of the electrode 163, theelectrode 165, and the electrode 167 (see FIG. 6).

<Modification Example 2 of Semiconductor Device>

A modification example of the semiconductor device described inEmbodiment 1 is described using FIG. 7. A semiconductor device describedin FIG. 7 is different from the semiconductor device in FIGS. 1A and 1Bin that the first nitride insulating film 111 is in contact with thesecond nitride insulating film 113.

Specifically, the complementary metal oxide semiconductor (CMOS) circuit105 in which the transistor 101 that is an n-channel transistorincluding the first semiconductor material and the transistor 103 thatis a p-channel transistor are electrically connected to each other isprovided in a lower portion; the capacitor 107 and the transistor 109that is an n-channel transistor including the second semiconductormaterial are provided over the CMOS circuit 105; the first nitrideinsulating film 111 which contains hydrogen and releases hydrogen byheating is provided between the transistor 109 and each of thetransistor 101 and the transistor 103; and the second nitride insulatingfilm 113 which has a lower hydrogen content than the first nitrideinsulating film 111 and functions as a barrier film against hydrogen isprovided to be stacked over the first nitride insulating film 111.

The element isolation insulating films 151 are provided over thesubstrate 115 to surround the transistor 101 and the transistor 103.Further, the insulating film 153 is provided to cover the transistors101 and 103 and the element isolation insulating films 151.

The interlayer insulating film 155 is provided over the insulating film153.

The first nitride insulating film 111 is provided over the electrodes163, 165, and 167 and the insulating film 169. The second nitrideinsulating film 113 is provided in contact with the first nitrideinsulating film 111, and the insulating film 171 is provided over thesecond nitride insulating film 113.

The source electrode 175 is connected to the electrode 163 via theconnection electrode 172 which is provided in an opening formed in thefirst nitride insulating film 111, the second nitride insulating film113, and the insulating film 171. The source electrode 175 iselectrically connected to the gate electrode 125 of the transistor 101and the gate electrode 143 of the transistor 103.

The drain electrode 177 is connected to the electrode 167 via theconnection electrode 172 which is provided in an opening formed in thefirst nitride insulating film 111, the second nitride insulating film113, and the insulating film 171.

The other structure is the same as that shown in Embodiment 1.

<Method for Manufacturing Modification Example 2 of SemiconductorDevice>

Next, a method for manufacturing the modification example of thesemiconductor device is described with reference to FIGS. 4A and 4B toFIG. 6, FIGS. 8A to 8C, and FIG. 9.

Through a process which is the same as that in Embodiment 1, thetransistor 101 and the transistor 103 are manufactured as illustrated inFIG. 8A. Then, the insulating film 153 is formed over the transistor 101and the transistor 103.

Next, the interlayer insulating film 155 is formed over the insulatingfilm 153. After that, the electrode 131, the electrode 147, and theelectrode 149 are formed (see FIG. 8B).

Next, the interlayer insulating film 157 is formed over the interlayerinsulating film 155, the electrode 131, the electrode 147, and theelectrode 149. An opening reaching the gate electrode 125 and the gateelectrode 143 is formed in the interlayer insulating film 157 (notillustrated), and the electrode 159 is formed in and over the opening.Then, the interlayer insulating film 161 is formed over the interlayerinsulating film 157 and the electrode 159 (see FIG. 8C).

Next, an opening reaching the electrode 159 is formed in the interlayerinsulating film 161 and the electrode 163 is formed in and over theopening. The electrode 165 and the electrode 167 can be formed at thesame time as the formation of the electrode 163. Then, the insulatingfilm 169 which fills spaces between the electrode 163, the electrode165, and the electrode 167 is formed. The first nitride insulating film111 is formed over the electrodes 163, 165, and the electrode 167 andthe insulating film 169, and the second nitride insulating film 113 isformed over the first nitride insulating film 111 (see FIG. 9).

It is preferable that the first nitride insulating film 111 have such athickness that the first nitride insulating film 111 contains hydrogenenough to sufficiently perform hydrogenation treatment on at least thechannel formation regions 117 and 135 of the transistors 101 and 103.For example, the thickness of the first nitride insulating film 111 isgreater than or equal to 50 nm and less than or equal to 1000 nm,preferably greater than or equal to 100 nm and less than or equal to 500nm.

The first nitride insulating film 111 can be formed using a formationmethod which is similar to that of the nitride insulating film 111described in Embodiment 1 as appropriate.

The second nitride insulating film 113 preferably has a thickness enoughto exhibit a sufficient barrier property against hydrogen which isdiffused from a portion below the transistor 109 into the oxidesemiconductor film 173 of the transistor 109. For example, the secondnitride insulating film 113 has a thickness greater than or equal to 5nm and less than or equal to 100 nm, preferably greater than or equal to15 nm and less than or equal to 50 nm.

The second nitride insulating film 113 can be formed using a formationmethod which is similar to that of the nitride insulating film 113described in Embodiment 1 as appropriate.

After that, the steps of FIG. 4B to FIG. 6 are performed in a mannersimilar to those in Embodiment 1, so that the insulating film 171, theconnection electrode 172, the transistor 109, the capacitor 107, and theinsulating film 185 can be formed.

<Modification Example 3 of Semiconductor Device>

The semiconductor device that is one embodiment of the present inventionmay have the structure of the modification example 2 of thesemiconductor device in which an oxide insulating film is providedbetween the first nitride insulating film 111 and the second nitrideinsulating film 113 so as to be in contact with the first nitrideinsulating film 111 and the second nitride insulating film 113. Theoxide insulating film can be a silicon oxide film or a siliconoxynitride film.

In the semiconductor device that is one embodiment of the presentinvention, the second nitride insulating film 113 has a lower hydrogenconcentration than the first nitride insulating film 111 and is formedof a dense nitride insulating film. Therefore, the second nitrideinsulating film 113 functions as a barrier film against hydrogen. In thecase where the first nitride insulating film 111 which is formed of anitride insulating film containing hydrogen is provided in contact withthe second nitride insulating film 113, depending on the formationmethod of the second nitride insulating film 113, hydrogen which iscontained in the first nitride insulating film 111 might be mixed intothe second nitride insulating film 113 to increase the hydrogenconcentration of the second nitride insulating film 113. Therefore, theoxide insulating film is provided between the first nitride insulatingfilm 111 and the second nitride insulating film 113 as described above,whereby the hydrogen contained in the first nitride insulating film 111can be prevented from mixing into the second nitride insulating film 113at the time of forming the second nitride insulating film 113, and thusthe second nitride insulating film 113 can sufficiently function as abarrier film against hydrogen.

<Modification Example 4 of Semiconductor Device>

The structures of Modification Examples 2 and 3 of the semiconductordevice are not limited to the structure illustrated in FIG. 7. Forexample, when the electrode 163, the electrode 165, and the electrode167 are formed using a conductive film which is less likely to transmitoxygen or formed by stacking oxide films having a barrier propertyagainst oxygen (e.g., a ruthenium oxide film), the first nitrideinsulating film 111 and the second nitride insulating film 113 can beprovided between the interlayer insulating film 161 and each of theelectrode 163, the electrode 165, and the electrode 167 (see FIG. 10A).Alternatively, the electrodes 163, 165, and 167 may be provided betweenthe first nitride insulating film 111 and the second nitride insulatingfilm 113 (see FIG. 10B). Any of such structures enables prevention ofoxidation of the electrodes 163, 165, and 167, thereby preventing anincrease in resistance values of the electrodes 163, 165, and 167.

Note that the structures, methods, and the like described in thisembodiment can be used as appropriate in combination with any of thestructures, methods, and the like described in the other embodiments andexamples.

Embodiment 2

As another example of the semiconductor device that is one embodiment ofthe present invention, an example of a cross-sectional view of a NORcircuit, which is a logic circuit, is illustrated in FIG. 11A. FIG. 11Bis a circuit diagram of the NOR circuit in FIG. 11A, and FIG. 11C is acircuit diagram of a NAND circuit.

FIG. 11A is a cross-sectional view of part of the NOR circuit,specifically, a cross-sectional view of transistors 202 and 203 whichare a p-channel transistor and an n-channel transistor, respectively.FIG. 12 is a top view of the part of the NOR circuit. Thecross-sectional view illustrated in FIG. 11A corresponds to a crosssection taken along a dashed dotted line X-Y in the top view in FIG. 12.In the top view in FIG. 12, some components (the transistor 202, a firstnitride insulating film 211, a second nitride insulating film 213, othergate insulating films and interlayer insulating films, and the like) arenot illustrated for clarification of the drawing.

The structure of the semiconductor device of this embodiment is partlydifferent from that of the semiconductor device described in Embodiment1 and can be manufactured as appropriate using the method formanufacturing the semiconductor device described in Embodiment 1.

In other words, the semiconductor of this embodiment includes aplurality of transistors, and some of the transistors are stacked in thelongitudinal direction in order to increase the degree of integration.In the semiconductor device in FIG. 11A which corresponds to the NORcircuit diagram in FIG. 11B, the first nitride insulating film 211 whichcontains hydrogen and releases hydrogen by heating is provided overtransistors 201 and 202 which are p-channel transistors, and the secondnitride insulating film 213 which has a lower hydrogen content than thefirst nitride insulating film 211 and functions as a barrier filmagainst hydrogen is provided between the first nitride insulating film211 and each of the transistor 203 and a transistor 204.

In the semiconductor device illustrated in FIG. 11A, a single crystalsilicon substrate is used as a substrate 200, the transistor 202 isprovided on the single crystal silicon substrate, and the transistor 203including an oxide semiconductor is stacked over the transistor 202.Although not illustrated, the transistor 201 can be provided on thesubstrate 200 on which the transistor 202 is provided. Further, althoughnot illustrated, the transistor 204 including an oxide semiconductor canbe provided over the transistor 202.

The first nitride insulating film 211 provided over the transistor 202has the same structure as the first nitride insulating film 111 of thesemiconductor device described in Embodiment 1. Therefore, also in thesemiconductor device described in this embodiment, at least defects(dangling bonds) included in the single crystal silicon substrate wherechannel formation regions of the transistors 201 and 202 are formed canbe repaired by heat treatment.

The second nitride insulating film 213 provided between the firstnitride insulating film 211 and the transistor 203 has the samestructure as the second nitride insulating film 113 of the semiconductordevice described in Embodiment 1. Therefore, also in the semiconductordevice described in this embodiment, hydrogen which exists in a portionlocated below the transistor 203 and including the first nitrideinsulating film 211 can be prevented from diffusing into the oxidesemiconductor film (at least the channel formation region) of thetransistor 203 as an impurity.

In FIG. 11A, the transistor 202 has the same structure as the transistor103 of the semiconductor device described in Embodiment 1. Further, thetransistor 203 has the same structure as the transistor 109 of thesemiconductor device described in Embodiment 1. Therefore, Embodiment 1can be referred to for details of the transistor 202 and the transistor203. Here, different structures from those of the semiconductor devicedescribed in Embodiment 1 are described. Note that the transistor 201and the transistor 204 have the same structures as the transistor 103and the transistor 109 of the semiconductor device described inEmbodiment 1, respectively.

An electrode 225 of the transistor 202 is electrically connected to asource electrode 245 a of the transistor 203 via an electrode 231, anelectrode 234, and a connection electrode 239. The electrode 231 isprovided in and over an opening formed in an interlayer insulating film230. The electrode 234 is formed in and over an opening formed in aninterlayer insulating film 233. Note that a drain electrode 245 b of thetransistor 203 is electrically connected to an electrode 236 via theconnection electrode 239.

An electrode 232 is formed in an opening (not illustrated) formed in theinterlayer insulating film 230. An electrode 235 is formed in and overan opening formed in the interlayer insulating film 233.

A gate electrode 205 of the transistor 203 is electrically connected tothe electrode 232 via the electrode 235, and electrically connected to agate electrode of the transistor 202 via the electrode 235 and theelectrode 232. Further, the gate electrode 205 of the transistor 203 iselectrically connected to an electrode 280. The electrode 280 iselectrically connected to an electrode 242. Note that the electrode 280includes a first barrier metal film 286, a second barrier metal film287, and a low-resistance conductive film 288 which is surrounded by thefirst bather metal film 286 and the second barrier metal film 287.

The electrode 280 can be formed in the following manner. First, aninterlayer insulating film 285 is formed, an opening reaching theelectrode 242 is formed in the interlayer insulating film 285, the firstbarrier metal film 286 is formed, and the low-resistance conductive film288 is formed thereover. After that, polishing for planarization isperformed to expose at least a surface of the low-resistance conductivefilm 288. To protect the exposed low-resistance conductive film 288, thesecond barrier metal film 287 is formed.

As the low-resistance conductive film 288, a copper film or a copperalloy film can be used. Each of the first barrier metal film 286 and thesecond barrier metal film 287 can be formed using a conductive materialwhich prevents diffusion of copper contained in the low-resistanceconductive film 288. Examples of the conductive material include atantalum nitride film, a molybdenum nitride film, and a tungsten nitridefilm.

Further, when voltage can be applied to an electrode 237 which isprovided over the interlayer insulating film 233 and can be formed inthe same process as the electrodes 234, 235, and 236, the electrode 237can also function as a back gate electrode of the transistor 203.

In the case where an insulating film containing oxygen is used as aninterlayer insulating film 238 to reduce oxygen vacancies in an oxidesemiconductor film 273 of the transistor 203, oxygen which is containedin the interlayer insulating film 238 can be prevented from diffusingdownward from the interlayer insulating film 238 (e.g., to theelectrodes 234, 235, 236, and 237) because the second nitride insulatingfilm 213 is less likely to transmit oxygen as well as hydrogen;accordingly, the oxygen vacancies in the oxide semiconductor film 273can be reduced sufficiently. Thus, the transistor 203 having favorableelectrical characteristics and favorable reliability can be obtained.Further, a semiconductor device having favorable electricalcharacteristics and favorable reliability can be obtained.

Since the transistor which includes the channel formation region in thesilicon semiconductor region and operates at a high speed and thetransistor which includes the channel formation region in the oxidesemiconductor film and has a small off-state current are provided in thesemiconductor device in FIG. 11A, the operation speed of thesemiconductor device can be high and power consumption thereof can besufficiently reduced.

In a manner similar to that of the semiconductor device described inEmbodiment 1, the semiconductor device illustrated in FIGS. 11A to 11Cand FIG. 12 does not necessarily have the structure in FIGS. 11A to 11Cand FIG. 12. For example, when the electrode 234, the electrode 235, theelectrode 236, and the electrode 237 are formed using a conductive filmfrom which is less likely to transmit oxygen or formed by stacking oxidefilms having a bather property against oxygen (e.g., a ruthenium oxidefilm), the second nitride insulating film 213 can be provided betweenthe interlayer insulating film 233 and each of the electrode 234, theelectrode 235, the electrode 236, and the electrode 237 (see FIG. 13).

In the NAND circuit illustrated in FIG. 11C, transistors 251 and 254which are p-channel transistors each have the same structure as thetransistor 103 illustrated in FIG. 1A, in which a channel formationregion is formed in a silicon semiconductor region. Transistors 252 and253 which are n-channel transistors each have the same structure as thetransistor 109 illustrated in FIG. 1A, in which a channel formationregion is formed in an oxide semiconductor film. Embodiment 1 can bereferred to for details of the transistors 103 and 109. Note that theNAND circuit illustrated in FIG. 11C differs in the connection relationfrom the NOR circuit in FIG. 11B; therefore, the above description canbe referred to for a cross-sectional structure of the NAND circuit and astacked-layer structure of the transistors in the NAND circuit.

<Modification Example 1 of Semiconductor Device>

A modification example of the semiconductor device described in thisembodiment is illustrated in FIGS. 14A to 14C. In the semiconductordevice corresponds to the NOR circuit in FIG. 14A, the first nitrideinsulating film 211 which contains hydrogen and releases hydrogen byheating is provided between the transistors 201 and 202 which arep-channel transistors and the transistors 203 and 204, and the secondnitride insulating film 213 which has a lower hydrogen content than thefirst nitride insulating film 211 and functions as a barrier filmagainst hydrogen is provided over the first nitride insulating film 211.

When the electrode 234, the electrode 235, the electrode 236, and theelectrode 237 are formed using a conductive film which is less likely totransmit oxygen or formed by stacking conductive films having a barrierproperty against oxygen in the semiconductor device illustrated in FIGS.14A to 14C, the second nitride insulating film 213 can be providedbetween the interlayer insulating film 233 and each of the electrode234, the electrode 235, the electrode 236, and the electrode 237 (seeFIG. 15A). Alternatively, the electrode 234, the electrode 235, and theelectrode 236 may be provided between the first nitride insulating film211 and the second nitride insulating film 213 (see FIG. 15B).

<Modification Example 2 of Semiconductor Device>

Although the NOR circuit and the NAND circuit are described as examplesin this embodiment, this embodiment is not particularly limited thereto.An AND circuit, an OR circuit, or the like can be formed using atransistor including a silicon semiconductor and a transistor includingan oxide semiconductor. For example, a semiconductor device (memorydevice) which can hold data even when not being supplied with power andcan perform writing operation any number of times without limitation canbe manufactured using a transistor including a silicon semiconductor anda transistor including an oxide semiconductor.

FIG. 16 illustrates a circuit diagram of the semiconductor device (alsoreferred to as a memory element or a memory cell).

In FIG. 16, a first wiring (1st Line) is electrically connected to asource electrode of a transistor 301 which is an n-channel transistor. Asecond wiring (2nd Line) is electrically connected to a drain electrodeof the transistor 301. As the transistor 301, the transistor 101 or thetransistor 103 described in Embodiment 1 can be used.

A third wiring (3rd Line) is electrically connected to one of a sourceelectrode and a drain electrode of a transistor 303, and a fourth wiring(4th Line) is electrically connected to a gate electrode of thetransistor 303. A gate electrode of the transistor 301 and one of asource electrode and a drain electrode of the transistor 303 areelectrically connected to one electrode of a capacitor 305. A fifthwiring (5th line) is electrically connected to the other electrode ofthe capacitor 305.

The transistor 109 described in Embodiment 1 can be used as thetransistor 303. Note that the capacitor 107 described in Embodiment 1can be used as the capacitor 305.

The semiconductor device having the circuit configuration in FIG. 16utilizes a characteristic in which the potential of the gate electrodeof the transistor 301 can be held, and thus enables data writing,holding, and reading as follows.

Writing and holding of data are described. First, the potential of thefourth wiring is set to potential at which the transistor 303 is turnedon, so that the transistor 303 is turned on. Accordingly, the potentialof the third wiring is supplied to the gate electrode of the transistor301 and to the capacitor 305. In other words, a predetermined charge issupplied to the gate electrode of the transistor 301 (writing). Here,charge for supplying either of two different potential levels(hereinafter referred to as low-level charge and high-level charge) isgiven. After that, the potential of the fourth wiring is set to apotential at which the transistor 303 is off, so that the transistor 303is turned off. Thus, the charge supplied to the gate electrode of thetransistor 301 is held (holding).

Since the off-state current of the transistor 303 is extremely low, thecharge of the gate electrode of the transistor 301 is held for a longtime.

Next, reading of data is described. By supplying an appropriatepotential (reading potential) to the fifth wiring with a predeterminedpotential (constant potential) supplied to the first wiring, thepotential of the second wiring varies depending on the amount of chargeheld in the gate electrode of the transistor 301. This is because ingeneral, when the transistor 301 is an n-channel transistor, an apparentthreshold voltage V_(th) _(_) _(H) in the case where the high-levelcharge is given to the gate electrode of the transistor 301 is lowerthan an apparent threshold voltage V_(th) _(_) _(L) in the case wherethe low-level charge is given to the gate electrode of the transistor301. Here, the apparent threshold voltage refers to the potential of thefifth wiring, which is needed to turn on the transistor 301. Thus, thepotential of the fifth wiring is set to a potential V₀ that is betweenV_(th) _(_) _(H) and V_(th) _(_) _(L), whereby charge applied to thegate electrode of the transistor 301 can be determined. For example, inthe case where the high-level charge is given in writing, when thepotential of the fifth wiring is set to V₀ (>V_(th) _(_) _(H)), thetransistor 301 is turned on. In the case where the low-level charge isgiven in writing, even when the potential of the fifth wiring is set toV₀ (<V_(th) _(_) _(L)), the transistor 301 remains in an off state.Therefore, the stored data can be read by the potential of the secondwiring.

Note that in the case where memory cells are arrayed to be used, onlydata of desired memory cells needs to be read. In the case where readingis not performed in this manner, a potential at which the transistor 301is turned off regardless of the state of the gate electrode of thetransistor 301, that is, a potential smaller than V_(th) _(_) _(H) maybe supplied to the fifth wiring. Alternatively, a potential at which thetransistor 301 is turned on regardless of the state of the gateelectrode of the transistor 301, that is, a potential higher than V_(th)_(_) _(L) may be supplied to the fifth wiring.

FIG. 17 illustrates an example of one mode of a semiconductor devicewhich is different from the semiconductor device illustrated in FIG. 16.

FIG. 17 is a perspective view of the semiconductor device. Thesemiconductor device illustrated in FIG. 17 includes a plurality oflayers of memory cell arrays (memory cell arrays 401(1) to 401(n) (n isan integer greater than or equal to 2)) each including a plurality ofmemory cells as memory circuits in an upper portion, and a logic circuit403 in the lower portion which is necessary for operating the memorycell arrays 401(1) to 401(n).

FIG. 17 illustrates the logic circuit 403, the memory cell array 401(1),and the memory cell array 401(2), and illustrates a memory cell 405 aand a memory cell 405 b as typical examples among the plurality ofmemory cells included in the memory cell array 401(1) and the memorycell array 401(2). The memory cell 405 a and the memory cell 405 b canhave a configuration similar to the circuit configuration described inthis embodiment with reference to FIG. 16, for example.

A transistor in which a channel formation region is formed in an oxidesemiconductor film is used as each transistor included in the memorycells 405 a and 405 b. The transistor in which a channel formationregion is formed in an oxide semiconductor film has a structure similarto that described in Embodiment 1.

The logic circuit 403 includes a transistor in which a semiconductormaterial other than an oxide semiconductor is used for a channelformation region. For example, the transistor including a siliconsemiconductor described in Embodiment 1 (the transistor 101 or thetransistor 103) can be used.

The memory cell arrays 401(1) to 401(n) and the logic circuit 403 arestacked with interlayer insulating films provided therebetween, and areelectrically connected as appropriate by an electrode (including awiring) penetrating the interlayer insulating films.

When the transistor having extremely small off-state current in which achannel formation region is formed in an oxide semiconductor film isapplied to the semiconductor device in this embodiment, thesemiconductor device can hold data for an extremely long time. In otherwords, power consumption can be adequately reduced because refreshoperation becomes unnecessary or the frequency of refresh operation canbe extremely low. Moreover, stored data can be held for a long periodeven when power is not supplied (note that a potential is preferablyfixed).

Further, in the semiconductor device described in this embodiment, highvoltage is not needed for writing data and there is no problem ofdeterioration of elements. For example, unlike a conventionalnon-volatile memory, it is not necessary to inject and extract electronsinto and from a floating gate; thus, the problem of deterioration of agate insulating film does not occur. In other words, the semiconductordevice according to one embodiment of the present invention does nothave a limit on the number of times of writing which is a problem in aconventional nonvolatile memory, and reliability thereof is drasticallyimproved. Furthermore, data is written depending on the on state and theoff state of the transistor, whereby high-speed operation can be easilyachieved.

As described above, since the transistor which includes the channelformation region in the silicon semiconductor region and operates at ahigh speed and the transistor which includes the channel formationregion in the oxide semiconductor film and has an extremely smalloff-state current are provided in the semiconductor device described inthis embodiment, the operation speed of the semiconductor device can behigh and power consumption thereof can be sufficiently reduced. Further,by including the first nitride insulating film which contains hydrogenand releases hydrogen by heating and the second nitride insulating filmwhich has a lower hydrogen content than the first nitride insulatingfilm and functions as a barrier film against hydrogen, the semiconductordevice can have favorable electrical characteristics and favorablereliability.

Note that the structures, methods, and the like described in thisembodiment can be used as appropriate in combination with any of thestructures, methods, and the like described in the other embodiments andexamples.

Embodiment 3

In this embodiment, an example of an oxide semiconductor film which isapplicable to an oxide semiconductor film in a transistor including anoxide semiconductor which is applicable to the semiconductor devicedescribed in any of the semiconductor devices in the above embodimentsis described.

Besides an amorphous oxide semiconductor, a single crystal oxidesemiconductor, and a polycrystalline oxide semiconductor, an oxidesemiconductor including crystal parts (c-axis aligned oxidesemiconductor: CAAC-OS) is preferably used for an oxide semiconductorfilm in the transistor including an oxide semiconductor.

The CAAC-OS is one of oxide semiconductor films including a plurality ofcrystal parts, and most of each crystal part fits inside a cube whoseone side is less than 100 nm. Thus, there is a case where a crystal partincluded in the CAAC-OS film fits a cube whose one side is less than 10nm, less than 5 nm, or less than 3 nm. The density of defect states ofthe CAAC-OS film is lower than that of the microcrystalline oxidesemiconductor film. The CAAC-OS film is described in detail below.

In a transmission electron microscope (TEM) image of the CAAC-OS film, aboundary between crystal parts, that is, a grain boundary is not clearlyobserved. Thus, in the CAAC-OS film, a reduction in electron mobilitydue to the grain boundary is less likely to occur.

According to the TEM image of the CAAC-OS film observed in a directionsubstantially parallel to a sample surface (cross-sectional TEM image),metal atoms are arranged in a layered manner in the crystal parts. Eachmetal atom layer has a morphology reflected by a surface over which theCAAC-OS film is formed (hereinafter, a surface over which the CAAC-OSfilm is formed is referred to as a formation surface) or a top surfaceof the CAAC-OS film, and is arranged in parallel to the formationsurface or the top surface of the CAAC-OS film. In this specification, aterm “parallel” indicates that the angle formed between two straightlines is greater than or equal to −10° and less than or equal to 10°,and accordingly also includes the case where the angle is greater thanor equal to −5° and less than or equal to 5°. In addition, a term“perpendicular” indicates that the angle formed between two straightlines is greater than or equal to 80° and less than or equal to 100°,and accordingly includes the case where the angle is greater than orequal to 85° and less than or equal to 95°.

On the other hand, according to the TEM image of the CAAC-OS filmobserved in a direction substantially perpendicular to the samplesurface (plan TEM image), metal atoms are arranged in a triangular orhexagonal configuration in the crystal parts. However, there is noregularity of arrangement of metal atoms between different crystalparts.

From the results of the cross-sectional TEM image and the plan TEMimage, alignment is found in the crystal parts in the CAAC-OS film.

A CAAC-OS film is subjected to structural analysis with an X-raydiffraction (XRD) apparatus. For example, when the CAAC-OS filmincluding an InGaZnO₄ crystal is analyzed by an out-of-plane method, apeak appears frequently when the diffraction angle (2θ) is around 31°.This peak is derived from the (009) plane of the InGaZnO₄ crystal, whichindicates that crystals in the CAAC-OS film have c-axis alignment, andthat the c-axes are aligned in a direction substantially perpendicularto the formation surface or the top surface of the CAAC-OS film.

On the other hand, when the CAAC-OS film is analyzed by an in-planemethod in which an X-ray enters a sample in a direction perpendicular tothe c-axis, a peak appears frequently when 2θ is around 56°. This peakis derived from the (110) plane of the InGaZnO₄ crystal. Here, analysis(φ scan) is performed under conditions where the sample is rotatedaround a normal vector of a sample surface as an axis (φ axis) with 2θfixed at around 56°. In the case where the sample is a single-crystaloxide semiconductor film of InGaZnO₄, six peaks appear. The six peaksare derived from crystal planes equivalent to the (110) plane. On theother hand, in the case of a CAAC-OS film, a peak is not clearlyobserved even when φ scan is performed with 2θ fixed at around 56°.

According to the above results, in the CAAC-OS film having c-axisalignment, while the directions of a-axes and b-axes are differentbetween crystal parts, the c-axes are aligned in a direction parallel toa normal vector of a formation surface or a normal vector of a topsurface. Thus, each metal atom layer arranged in a layered mannerobserved in the cross-sectional TEM image corresponds to a planeparallel to the a-b plane of the crystal.

Note that the crystal part is formed concurrently with deposition of theCAAC-OS film or is formed through crystallization treatment such as heattreatment. As described above, the c-axis of the crystal is aligned witha direction parallel to a normal vector of a formation surface or anormal vector of a top surface. Thus, for example, in the case where ashape of the CAAC-OS film is changed by etching or the like, the c-axismight not be necessarily parallel to a normal vector of a formationsurface or a normal vector of a top surface of the CAAC-OS film.

Further, the degree of crystallinity in the CAAC-OS film is notnecessarily uniform. For example, in the case where crystal growthleading to the CAAC-OS film occurs from the vicinity of the top surfaceof the film, the degree of the crystallinity in the vicinity of the topsurface is higher than that in the vicinity of the formation surface insome cases. Further, when an impurity is added to the CAAC-OS film, thecrystallinity in a region to which the impurity is added is changed, andthe degree of crystallinity in the CAAC-OS film varies depends onregions.

Note that when the CAAC-OS film with an InGaZnO₄ crystal is analyzed byan out-of-plane method, a peak of 2θ may also be observed at around 36°,in addition to the peak of 2θ at around 31°. The peak of 2θ at around36° indicates that a crystal having no c-axis alignment is included inpart of the CAAC-OS film. It is preferable that in the CAAC-OS film, apeak of 2θ appear at around 31° and a peak of 2θ do not appear at around36°.

There are three methods for forming a CAAC-OS.

The first method is to form an oxide semiconductor film at a temperaturehigher than or equal to 100° C. and lower than or equal to 450° C. toform, in the oxide semiconductor film, crystal parts in which the c-axesare aligned in the direction parallel to a normal vector of a surfacewhere the oxide semiconductor film is formed or a normal vector of asurface of the oxide semiconductor film.

The second method is to form an oxide semiconductor film with a smallthickness and then heat it at a temperature higher than or equal to 200°C. and lower than or equal to 700° C. to form, in the oxidesemiconductor film, crystal parts in which the c-axes are aligned in thedirection parallel to a normal vector of the surface where the oxidesemiconductor film is formed or to a normal vector of the top surface ofthe oxide semiconductor film.

The third method is to form a first oxide semiconductor film with asmall thickness, then heat it at a temperature higher than or equal to200° C. and lower than or equal to 700° C., and form a second oxidesemiconductor film to form, in the second oxide semiconductor, crystalparts in which the c-axes are aligned in the direction parallel to anormal vector of the surface where the second oxide semiconductor filmis formed or to a normal vector of the top surface of the second oxidesemiconductor film.

In a transistor in which a CAAC-OS is used for an oxide semiconductorfilm, change in electric characteristics due to irradiation with visiblelight or ultraviolet light is small. Accordingly, the transistorincluding a CAAC-OS film as an oxide semiconductor film has favorablereliability.

Further, it is preferable that the CAAC-OS film be deposited by asputtering method with a polycrystalline oxide semiconductor sputteringtarget. When ions collide with the sputtering target, a crystal regionincluded in the sputtering target may be separated from the target alongan a-b plane; in other words, a sputtered particle having a planeparallel to an a-b plane (flat-plate-like sputtered particle orpellet-like sputtered particle) may flake off from the sputteringtarget. In this case, the flat-plate-like sputtered particle or thepellet-like sputtered particle reaches a surface where the CAAC-OS filmis to be deposited while maintaining its crystal state, whereby theCAAC-OS film can be deposited.

For the deposition of the CAAC-OS film, the following conditions arepreferably used.

By reducing the amount of impurities entering the CAAC-OS film duringthe deposition, the crystal state can be prevented from being broken bythe impurities. For example, the concentration of impurities (e.g.,hydrogen, water, carbon dioxide, or nitrogen) which exist in thedeposition chamber may be reduced. Furthermore, the concentration ofimpurities in a deposition gas may be reduced. Specifically, adeposition gas whose dew point is −80° C. or lower, preferably −100° C.or lower is used.

Specifically, the heating temperature of the surface where the CAAC-OSfilm is formed during the deposition is higher than or equal to 100° C.and lower than or equal to 740° C., preferably higher than or equal to200° C. and lower than or equal to 500° C. By increasing the temperatureof the surface where the CAAC-OS film is formed during the deposition,when the flat-plate-like or pellet-like sputtered particle reaches thesurface where the CAAC-OS film is formed, migration occurs on thesurface where the CAAC-OS film is formed, so that a flat plane of thesputtered particle is attached to the surface where the CAAC-OS film isformed.

Furthermore, it is preferable that the proportion of oxygen in thedeposition gas be increased and the power be optimized in order toreduce plasma damage at the deposition. The proportion of oxygen in thedeposition gas is higher than or equal to 30 vol %, preferably higherthan or equal to 100 vol %.

As an example of the sputtering target, an In—Ga—Zn—O compound target isdescribed below.

The In—Ga—Zn-based metal oxide target, which is polycrystalline, is madeby mixing InO_(X) powder, GaO_(Y) powder, and ZnO_(Z) powder in apredetermined molar ratio, applying pressure, and performing heattreatment at a temperature higher than or equal to 1000° C. and lowerthan or equal to 1500° C. This pressure treatment may be performed whilecooling is performed or may be performed while heating is performed.Note that x, y, and z are each a given positive number. Here, thepredetermined molar ratio of InO_(x) powder to GaO_(y) powder andZnO_(z) powder is, for example, 2:2:1, 8:4:3, 3:1:1, 1:1:1, 4:2:3, or3:1:2. The kinds of powder and the molar ratio for mixing powder may bedetermined as appropriate depending on the desired sputtering target.

In the case where a single crystal oxide semiconductor is applied to anoxide semiconductor film in the transistor including an oxidesemiconductor, the single crystal oxide semiconductor may be formed insuch a manner that a CAAC-OS is formed and subjected to heating by laserirradiation treatment. A gas laser or a solid-state laser of continuousoscillation or a pulsed oscillation can be used for the laserirradiation. The following laser can be used as the gas laser: anexcimer laser, a YAG laser, a YVO₄ laser, a YLF laser, YAlO₃ laser, aglass laser, a ruby laser, a Ti: sapphire laser, or the like. As asolid-state laser, a laser using crystals such as YAG, YVO₄, YLF, andYAlO₃ doped with Cr, Nd, Er, Ho, Ce, Co, Ti, or Tm can be used.

In the transistor including an oxide semiconductor, the oxidesemiconductor film may be a stack of oxide semiconductor films. Forexample, the oxide semiconductor film may have a stacked-layer structureof a first oxide semiconductor film and a second oxide semiconductorfilm which are formed using metal oxides with different compositions.For example, the oxide semiconductor film can have a stacked-layerstructure of a first oxide semiconductor film and a second oxidesemiconductor film which differ in atomic ratio of metal elements.Alternatively, the oxide semiconductor film can have a stacked-layerstructure of a first oxide semiconductor film and a second oxidesemiconductor film which have different metal elements. Note that anoxide containing two kinds of metals, an oxide containing three kinds ofmetals, or an oxide containing four kinds of metals can be used asappropriate for each of the first oxide semiconductor film and thesecond oxide semiconductor film.

Further, it is possible that the constituent elements of the first oxidesemiconductor film and the second oxide semiconductor film are the sameand the compositions of the constituent elements of the first oxidesemiconductor film and the second oxide semiconductor film aredifferent. For example, the first oxide semiconductor film may have anatomic ratio of In:Ga:Zn=1:1:1, and the second oxide semiconductor filmmay have an atomic ratio of In:Ga:Zn=3:1:2. Alternatively, the firstoxide semiconductor film may have an atomic ratio of In:Ga:Zn=1:3:2, andthe second oxide semiconductor film may have an atomic ratio ofIn:Ga:Zn=2:1:3. Note that a proportion of each atom in the atomic ratioof the oxide semiconductor varies within a range of ±20% as an error.

At this time, one of the first oxide semiconductor film and the secondoxide semiconductor film which is closer to the gate electrode (on achannel side) preferably contains In and Ga at a proportion of In>Ga.The other which is farther from the gate electrode (on a back channelside) preferably contains In and Ga at a proportion of In≦Ga.

Further, the oxide semiconductor film included in the transistorincluding an oxide semiconductor may have a three-layer structure of afirst oxide semiconductor film, a second oxide semiconductor film, and athird oxide semiconductor film, in which the constituent elementsthereof are made the same but the compositions of the first oxidesemiconductor film, the second oxide semiconductor film, and the thirdoxide semiconductor film are made different from each other. Forexample, the first oxide semiconductor film may have an atomic ratio ofIn:Ga:Zn=1:3:2, the second oxide semiconductor film may have an atomicratio of In:Ga:Zn=3:1:2, and the third oxide semiconductor film may havean atomic ratio of In:Ga:Zn=1:1:1.

In an oxide semiconductor film which contains less In than Ga and Zn atan atomic ratio, typically, the first oxide semiconductor filmcontaining In, Ga, and Zn at an atomic ratio of 1:3:2, generation ofoxygen vacancies can be more inhibited than in an oxide semiconductorfilm containing more In than Ga and Zn at an atomic ratio, typically,the second oxide semiconductor film, and an oxide semiconductor filmcontaining Ga, Zn, and In at the same atomic ratio, typically, the thirdoxide semiconductor film, and accordingly, an increase in carrierdensity can be suppressed. Further, when the first oxide semiconductorfilm containing In, Ga, and Zn at an atomic ratio of 1:3:2 has anamorphous structure, the second oxide semiconductor film is likely to bea CAAC-OS film.

Since the constituent elements of the first oxide semiconductor film,the second oxide semiconductor film, and the third oxide semiconductorfilm are the same, the first oxide semiconductor film has fewer defectlevels (trap levels) at the interface with the second oxidesemiconductor film. Accordingly, when an oxide semiconductor film hasthe above structure, changes over time or variation in threshold voltageof a transistor due to a BT stress test under light can be reduced.

In an oxide semiconductor, the s orbital of heavy metal mainlycontributes to carrier transfer, and when the In content in the oxidesemiconductor is increased, overlap of the s orbitals is likely to beincreased. Therefore, an oxide having a composition of In>Ga has highercarrier mobility than an oxide having a composition of In≦Ga. Further,in Ga, the formation energy of oxygen vacancy is larger and thus oxygenvacancy is less likely to occur, than in In; therefore, the oxide havinga composition of In≦Ga has more stable characteristics than the oxidehaving a composition of In>Ga.

In the case of a transistor in which oxide semiconductor films arestacked, an oxide semiconductor film containing In and Ga at acomposition of In>Ga is used on the channel side, and an oxidesemiconductor film containing In and Ga at a proportion of In≦Ga is usedon the back channel side, so that the field-effect mobility andreliability of the transistor can be further improved.

Further, the first oxide semiconductor film, the second oxidesemiconductor film, and the third oxide semiconductor film may be formedusing oxide semiconductor films having different crystallinity. That is,the first oxide semiconductor film and the second oxide semiconductorfilm may be formed using a combination of any of a single crystal oxidesemiconductor, a polycrystalline oxide semiconductor, a microcrystallineoxide semiconductor, an amorphous oxide semiconductor, and a CAAC-OS asappropriate. When an amorphous oxide semiconductor film is applied toany of the first oxide semiconductor film, the second oxidesemiconductor film, and the third oxide semiconductor film, internalstress or external stress of the oxide semiconductor film is relieved,variation in characteristics of a transistor is reduced, and thereliability of the transistor can be further improved.

Note that the structures, methods, and the like described in thisembodiment can be used as appropriate in combination with any of thestructures, methods, and the like described in the other embodiments andexamples.

Embodiment 4

In this embodiment, an example which is applicable to a transistorincluding an oxide semiconductor which is included in a semiconductordevice that is one embodiment of the present invention is described.

FIG. 18 illustrates a transistor 110 with a structure which is partlydifferent from that of the transistor including an oxide semiconductorwhich is described in the above embodiment. Note that only thetransistor 110 including an oxide semiconductor is illustrated and atransistor including a silicon semiconductor, a capacitor, and the likeare not illustrated in FIG. 18. The reference numerals, which are usedfor describing the semiconductor device in FIG. 1A, are used for thetransistor 110 in this embodiment.

The transistor 110 includes the insulating film 171 which also functionsas a base insulating film, the oxide semiconductor film 173, the sourceelectrode 175 and the drain electrode 177 which are in contact with theoxide semiconductor film 173, the gate insulating film 179 in which anoxide insulating film 178 and a nitride insulating film 180 are stacked,the gate electrode 181 which is provided over the gate insulating film179, and an insulating film 184 and the insulating film 185 which coverthe insulating film 171, the source electrode 175, the drain electrode177, the gate insulating film 179, and the gate electrode 181.

The transistor 110 differs from the transistor 109 in the followingstructure. The source electrode 175 and the drain electrode 177 eachhave a step in its end portion. In the gate insulating film 179, theoxide insulating film 178 is provided on a side in contact with theoxide semiconductor film 173, and the nitride insulating film 180 isstacked over the oxide insulating film 178. Further, the gate insulatingfilm 179 is processed by etching treatment so that part of the sourceelectrode 175 and part of the drain electrode 177 are exposed. Inaddition, the insulating film 184 and the insulating film 185 arestacked.

Since only part of the structure of the transistor 110 is different fromthat of the transistor 109, the transistor 110 can be manufactured usingthe method for manufacturing the transistor 109 as appropriate. Forexample, heat treatment can be performed at the same timing as that inthe method for manufacturing the transistor 109.

In the transistor 110, the insulating film 171 and the oxidesemiconductor film 173 can be formed in a manner similar to theinsulating film and the oxide semiconductor film in the transistor 109.

In the transistor 110, the source electrode 175 and the drain electrode177 can be formed using a conductive film applicable to the sourceelectrode 175 and the drain electrode 177 of the transistor 109 in thefollowing manner. The conductive film is formed; a mask is formed overthe conductive film; the conductive film is processed using the mask sothat a desired channel length L is obtained; the mask is reduced in sizeby ashing or the like; and the conductive film is processed using themask which has been reduced in size, whereby the conductive film hassteps in its end portion. In this manner, coverage of the end portionsof the source and drain electrodes 175 and 177 with the insulating filmcan be increased.

The gate insulating film 179 in the transistor 110 is a stack of theoxide insulating film 178 and the nitride insulating film 180. The oxideinsulating film 178 in contact with the oxide semiconductor film 173preferably includes a region which contains oxygen in excess of that inthe stoichiometric composition (oxygen-excess region), and for example,can be formed of a silicon oxide film or a silicon oxynitride filmincluding a region which contains oxygen in excess of that in thestoichiometric composition (oxygen-excess region). In addition, thenitride insulating film 180 is preferably formed using a nitrideinsulating film applicable to the second nitride insulating film 113.

The silicon oxide film or the silicon oxynitride film applicable to theoxide insulating film 178 can be formed on the following conditions. Theformation conditions are as follows: the substrate placed in a treatmentchamber of a plasma CVD apparatus which is vacuum-evacuated is held at atemperature higher than or equal to 180° C. and lower than or equal to250° C., preferably higher than or equal to 180° C. and lower than orequal to 230° C., the pressure in the treatment chamber is greater thanor equal to 100 Pa and less than or equal to 250 Pa, preferably greaterthan or equal to 100 Pa and less than or equal to 200 Pa withintroduction of a source gas into the treatment chamber, andhigh-frequency power higher than or equal to 0.17 W/cm² and lower thanor equal to 0.5 W/cm², preferably higher than or equal to 0.25 W/cm² andlower than or equal to 0.35 W/cm², is supplied to an electrode providedin the treatment chamber. Note that a deposition gas containing siliconand an oxidation gas are used as source gases.

Since the nitride insulating film 180 can be formed in a manner similarto that of the second nitride insulating film 113, the above embodimentcan be referred to.

A conductive film to be processed into the gate electrode 181 is formedover the oxide insulating film and the nitride insulating film formed bythe above methods, a mask is formed over the conductive film, and theoxide insulating film, the nitride insulating film, and the conductivefilm are collectively processed by dry etching or the like using themask, whereby the gate insulating film 179 and the gate electrode 181 ofthe transistor 110 can be formed.

By forming the nitride insulating film 180 of the gate insulating film179 using a nitride silicon film, the following effect can be obtained.The silicon nitride film has a higher relative permittivity than asilicon oxide film and needs a larger thickness for an equivalentcapacitance. Thus, the physical thickness of the gate insulating filmcan be increased. Accordingly, a reduction in withstand voltage of thetransistor 110 is prevented and further the withstand voltage isimproved, so that ESD resistance of the semiconductor device can beenhanced. Accordingly, the yield of the transistor 110 can be improved;as a result, the yield of the semiconductor device can be improved.

The insulating film 184 can be formed in a manner similar to that of theoxide insulating film 178 and, in particular, is preferably an oxideinsulating film including a region which contains oxygen in excess ofthat in the stoichiometric composition (oxygen-excess region); forexample, a silicon oxide film or a silicon oxynitride film whichincludes a region which contains oxygen in excess of that in thestoichiometric composition (oxygen-excess region) can be used.

When the oxide insulating film 178 and the insulating film 184 eachinclude a region which contains oxygen in excess of that in thestoichiometric composition (oxygen-excess region) in the transistor 110,oxygen vacancies in the oxide semiconductor film 173 can be reduced byheat treatment in the manufacturing process of the transistor 110. Forexample, when the transistor 110 described in this embodiment ismanufactured, heat treatment is preferably performed after the formationof the insulating film 185. By reducing the oxygen vacancies, it ispossible to improve the electrical characteristics and reliability ofthe transistor 110. Accordingly, the electrical characteristics andreliability of the semiconductor device can be improved.

The insulating film 185 can be formed in a manner similar to that of thesecond nitride insulating film 113, and thus the above embodiment can bereferred to. The nitride silicon film applicable to the insulating film185 is less likely to transmit hydrogen; therefore, the insulating film185 can prevent the entry of hydrogen from the outside, so that theelectrical characteristics and reliability of the transistor 110 can beimproved. Accordingly, the electrical characteristics and reliability ofthe semiconductor device can be improved.

Note that the transistor 110 described in this embodiment can bereplaced with not only any of the transistors which are included in thesemiconductor devices described in Embodiment 1 and the modificationexamples thereof but also any of the transistors including an oxidesemiconductor which are included in the semiconductor devices describedin Embodiment 2 and the modification examples thereof. Further, in thecase where the transistor 110 is electrically connected to an electrodewhich is provided over a transistor including a silicon semiconductorand also functions as a wiring, the shapes of the source electrode 175and the drain electrode 177 of the transistor 110 can be changed asappropriate.

Note that the structures, methods, and the like described in thisembodiment can be used as appropriate in combination with any of thestructures, methods, and the like described in the other embodiments andexamples.

Embodiment 5

In this embodiment, a central processing unit (CPU) at least part ofwhich includes the semiconductor device described in the aboveembodiment is described as an example of a semiconductor device that isone embodiment of the present invention.

FIG. 19A is a block diagram illustrating a specific structure of theCPU. The CPU illustrated in FIG. 19A includes an arithmetic logic unit(ALU) 1191, an ALU controller 1192, an instruction decoder 1193, aninterrupt controller 1194, a timing controller 1195, a register 1196, aregister controller 1197, a bus interface (Bus I/F) 1198, a rewritableROM 1199, and a ROM interface (ROM I/F) 1189 over a substrate 1190. Asemiconductor substrate, an SOI substrate, a glass substrate, or thelike is used as the substrate 1190. The ROM 1199 and the ROM interface1189 may each be provided over a separate chip. Needless to say, the CPUin FIG. 19A is just an example in which the configuration has beensimplified, and an actual CPU may have various configurations dependingon the application.

An instruction that is input to the CPU through the bus interface 1198is input to the instruction decoder 1193 and decoded therein, and then,input to the ALU controller 1192, the interrupt controller 1194, theregister controller 1197, and the timing controller 1195.

The ALU controller 1192, the interrupt controller 1194, the registercontroller 1197, and the timing controller 1195 conduct various controlsin accordance with the decoded instruction. Specifically, the ALUcontroller 1192 generates signals for controlling the operation of theALU 1191. While the CPU is executing a program, the interrupt controller1194 judges an interrupt request from an external input/output device ora peripheral circuit on the basis of its priority or a mask state, andprocesses the request. The register controller 1197 generates an addressof the register 1196, and reads/writes data from/to the register 1196 inaccordance with the state of the CPU.

The timing controller 1195 generates signals for controlling operationtimings of the ALU 1191, the ALU controller 1192, the instructiondecoder 1193, the interrupt controller 1194, and the register controller1197. For example, the timing controller 1195 includes an internal clockgenerator for generating an internal clock signal CLK2 based on areference clock signal CLK1, and supplies the internal clock signal CLK2to the above circuits.

In the CPU illustrated in FIG. 19A, a memory cell is provided in theregister 1196. As the memory cell of the register 1196, the memory celldescribed in the above embodiment can be used.

In the CPU illustrated in FIG. 19A, the register controller 1197 selectsoperation of holding data in the register 1196 in accordance with aninstruction from the ALU 1191. That is, the register controller 1197selects whether data is held by a flip-flop or by a capacitor in thememory cell included in the register 1196. When data holding by theflip-flop is selected, a power supply voltage is supplied to the memorycell in the register 1196. When data holding by the capacitor isselected, the data is rewritten in the capacitor, and supply of powersupply voltage to the memory cell in the register 1196 can be stopped.

The power supply can be stopped by providing a switching element betweena memory cell group and a node to which a power supply potential VDD ora power supply potential VSS is supplied, as illustrated in FIG. 19B orFIG. 19C. Circuits illustrated in FIGS. 19B and 19C are described below.

FIGS. 19B and 19C illustrate examples of a configuration in which thetransistor including an oxide semiconductor which is included in thesemiconductor device described in the above embodiment is applied to aswitching element for controlling supply of power supply potential tomemory cells.

The storage device illustrated in FIG. 19B includes a switching element1141 and a memory cell group 1143 including a plurality of memory cells1142. Specifically, as each of the memory cells 1142, the memory celldisclosed in the above embodiment can be used. Each of the memory cells1142 included in the memory cell group 1143 is supplied with thehigh-level power supply potential VDD via the switching element 1141.Further, each of the memory cells 1142 included in the memory cell group1143 is supplied with a potential of a signal IN and the low-level powersupply potential VSS.

In FIG. 19B, the transistor including an oxide semiconductor included inthe semiconductor device described in the above embodiment is applicableto the switching element 1141, and the switching of the transistor iscontrolled by a signal Sig A supplied to a gate electrode thereof.

Note that FIG. 19B illustrates the structure in which the switchingelement 1141 includes only one transistor; however, without particularlimitation thereon, the switching element 1141 may include a pluralityof transistors. In the case where the switching element 1141 includes aplurality of transistors which function as switching elements, theplurality of transistors may be connected to each other in parallel, inseries, or in combination of parallel connection and series connection.

Although the switching element 1141 controls the supply of thehigh-level power supply potential VDD to each of the memory cells 1142included in the memory cell group 1143 in FIG. 19B, the switchingelement 1141 may control the supply of the low-level power supplypotential VSS.

In FIG. 19C, an example of a storage device in which each of the memorycells 1142 included in the memory cell group 1143 is supplied with thelow-level power supply potential VSS via the switching element 1141 isillustrated. The supply of the low-level power supply potential VSS toeach of the memory cells 1142 included in the memory cell group 1143 canbe controlled by the switching element 1141.

When a switching element is provided between a memory cell group and anode to which the power supply potential VDD or the power supplypotential VSS is supplied, data can be held even in the case where anoperation of a CPU is temporarily stopped and the supply of the powersupply voltage is stopped; accordingly, power consumption can bereduced. Specifically, for example, while a user of a personal computerdoes not input data to an input device such as a keyboard, the operationof the CPU can be stopped, so that the power consumption can be reduced.

Although the CPU is given as an example, the transistor can also beapplied to an LSI such as a digital signal processor (DSP), a customLSI, or a field programmable gate array (FPGA).

Note that the structures, methods, and the like described in thisembodiment can be used as appropriate in combination with any of thestructures, methods, and the like described in the other embodiments andexamples.

Embodiment 6

In this embodiment, examples of an electronic appliance provided withthe semiconductor device described in the above embodiment are describedwith reference to FIGS. 20A to 20C. The semiconductor device describedin the above embodiment includes a transistor including an oxidesemiconductor with good switching characteristics, and thus enables areduction in the power consumption of the electronic appliance. Inaddition, a semiconductor device with a new structure using thecharacteristics of oxide semiconductors (e.g. a storage device such as amemory element or a memory cell) allows for achievement of an electronicappliance with a new structure. Note that the semiconductor devicedescribed in the above embodiment can be mounted on a circuit substrateor the like alone or integrated with other components, and thus builtinto the electronic appliance.

In many cases, an integrated circuit into which the semiconductor devicedescribed in the above embodiment is integrated includes a variety ofcircuit elements such as a resistor, a capacitor, and a coil in additionto the structure of the semiconductor device described in the aboveembodiment. An example of the integrated circuit is a circuit into whichan arithmetic circuit, a converter circuit, an amplifier circuit, amemory circuit, and circuits relating to any of these circuits arehighly integrated.

The semiconductor device is applicable to a switching element or thelike in a display device such as a television or a monitor. In thiscase, the semiconductor device and a driver circuit are preferablyprovided over the same substrate. Naturally it is also possible to usethe semiconductor device only for a driver circuit of the displaydevice.

Examples of the electronic appliances include display devices such astelevisions and monitors, lighting devices, desktop or laptop personalcomputers, word processors, image reproduction devices which reproducestill images or moving images stored in recording media such as Btu-rayDiscs and digital versatile discs (DVDs), portable compact disc (CD)players, radio receivers, tape recorders, headphone stereos, stereos,cordless phone handsets, transceivers, portable wireless devices, mobilephones, car phones, portable game machines, calculators, portableinformation terminals, electronic notebooks, e-book readers, electronictranslators, audio input devices, cameras such as still cameras andvideo cameras, electric shavers, high-frequency heating appliances suchas microwave ovens, electric rice cookers, electric washing machines,electric vacuum cleaners, air-conditioning systems such as airconditioners, dishwashers, dish dryers, clothes dryers, futon dryers,electric refrigerators, electric freezers, electricrefrigerator-freezers, freezers for preserving DNA, smoke detectors,radiation counters, medical equipment such as dialyzers, and the like.Further, the examples include industrial equipment such as guide lights,traffic lights, belt conveyors, elevators, escalators, industrialrobots, and power storage systems. In addition, oil engines, movingobjects driven by electric motors using power from the non-aqueoussecondary batteries, and the like are also included in the category ofelectronic appliances. Examples of the moving objects include electricvehicles (EV), hybrid electric vehicles (HEV) which include both aninternal-combustion engine and a motor, plug-in hybrid electric vehicles(PHEV), tracked vehicles in which caterpillar tracks are substituted forwheels of these vehicles, motorized bicycles including motor-assistedbicycles, motorcycles, electric wheelchairs, golf carts, boats or ships,submarines, helicopters, aircrafts, rockets, artificial satellites,space probes, planetary probes, spacecrafts, and the like. Specificexamples of these electronic appliances are shown in FIGS. 20A to 20C.

In a television set 8000 in FIG. 20A, a display portion 8002 isincorporated in a housing 8001. The display portion 8002 displays animage and a speaker portion 8003 can output sound.

A semiconductor display device such as a liquid crystal display device,a light-emitting device in which a light-emitting element such as anorganic EL element is provided in each pixel, an electrophoretic displaydevice, a digital micromirror device (DMD), a plasma display panel(PDP), or the like can be used for the display portion 8002.

The television set 8000 may be provided with a receiver, a modem, andthe like. Furthermore, when the television set 8000 is connected to acommunication network by wired or wireless connection via the modem,one-way (from a transmitter to a receiver) or two-way (between atransmitter and a receiver, between receivers, or the like) datacommunication can be performed.

In addition, the television set 8000 may include a CPU for performinginformation communication or a memory. The memory or the CPU describedin the above embodiment can be used for the television set 8000.

In FIG. 20A, an air conditioner which includes an indoor unit 8200 andan outdoor unit 8204 is an example of an electronic appliance which isprovided with the CPU of the above embodiment. Specifically, the indoorunit 8200 includes a housing 8201, an air outlet 8202, a CPU 8203, andthe like. Although the CPU 8203 is provided in the indoor unit 8200 inFIG. 20A, the CPU 8203 may be provided in the outdoor unit 8204.Alternatively, the CPU 8203 may be provided in both the indoor unit 8200and the outdoor unit 8204. By using the CPU described in the aboveembodiment as the CPU in the air conditioner, power consumption can bereduced.

In FIG. 20A, an electric refrigerator-freezer 8300 is an example of anelectronic appliance which is provided with the CPU described in theabove embodiment. Specifically, the electric refrigerator-freezer 8300includes a housing 8301, a door for a refrigerator 8302, a door for afreezer 8303, a CPU 8304, and the like. In FIG. 20A, the CPU 8304 isprovided in the housing 8301. When the CPU described in the aboveembodiment is used as the CPU 8304 of the electric refrigerator-freezer8300, power consumption of the electric refrigerator-freezer 8300 can bereduced.

FIGS. 20B and 20C illustrate an example of an electric vehicle which isan example of an electronic appliance. An electric vehicle 9700 isequipped with a secondary battery 9701. The output of the electric powerof the secondary battery 9701 is adjusted by a control circuit 9702 andthe electric power is supplied to a driving device 9703. The controlcircuit 9702 is controlled by a processing unit 9704 including a ROM, aRAM, a CPU, or the like (not illustrated). When the CPU described in theabove embodiment is used as the CPU in the electric vehicle 9700, powerconsumption of the electric vehicle 9700 can be reduced.

The driving device 9703 includes a DC motor or an AC motor either aloneor in combination with an internal-combustion engine. The processingunit 9704 outputs a control signal to the control circuit 9702 based oninput data such as data of operation (e.g., acceleration, deceleration,or stop) by a driver or data during driving (e.g., data on an upgrade ora downgrade, or data on a load on a driving wheel) of the electricvehicle 9700. The control circuit 9702 adjusts the electric energysupplied from the secondary battery 9701 in accordance with the controlsignal of the processing unit 9704 to control the output of the drivingdevice 9703. In the case where the AC motor is mounted, although notillustrated, an inverter which converts direct current into alternatecurrent is also incorporated.

Note that the structures, methods, and the like described in thisembodiment can be used as appropriate in combination with any of thestructures, methods, and the like described in the other embodiments andexamples.

Example 1

In this example, evaluation results of a nitride insulating film whichis applicable to the first nitride insulating film containing hydrogenwhich is included in the semiconductor device that is one embodiment ofthe present invention are described. Here, a nitride insulating filmwhich contains hydrogen and releases hydrogen is described as thenitride insulating film applicable to the first nitride insulating film.

First, a method for forming samples for evaluation is described. Astructure of each sample formed in this example is referred to asStructure 1. A silicon nitride film 993 is provided over a silicon wafer991 in Structure 1 (see FIG. 21A).

The silicon nitride film 993 was formed by a plasma CVD method usingfour conditions, Conditions 1 to 4. Samples formed under Conditions 1 to4 were Samples A1 to A4, respectively. Note that in each of Samples A1to A4, the silicon nitride film 993 had a thickness of 50 nm.

Condition 1 was as follows: a temperature at which the silicon wafer 991was held was 350° C.; silane with a flow rate of 10 sccm and nitrogenwith a flow rate of 5000 sccm were used as source gases; a pressure in atreatment chamber was 260 Pa; and a high-frequency power of 100 W (1.8W/cm² as a power density) at 27.12 MHz was supplied to parallel plateelectrodes. Note that the flow rate of nitrogen is 500 times that ofsilane.

Condition 2 was as follows: a temperature at which the silicon wafer 991was held was 350° C.; silane with a flow rate of 20 sccm and nitrogenwith a flow rate of 500 sccm were used as source gases; a pressure in atreatment chamber was 40 Pa; and a high-frequency power of 900 W (1.8W/cm² as a power density) at 27.12 MHz was supplied to parallel plateelectrodes. Note that the flow rate of nitrogen is 25 times that ofsilane.

Condition 3 is the same as Condition 2 except that ammonia was used as asource gas. A temperature at which the silicon wafer 991 was held was350° C.; silane with a flow rate of 20 sccm, nitrogen with a flow rateof 500 sccm, and ammonia with a flow rate of 10 sccm were used as sourcegases; a pressure in a treatment chamber was 40 Pa; and a high-frequencypower of 900 W (1.93 W/cm² as a power density) at 27.12 MHz was suppliedto parallel plate electrodes. Note that the flow rate of nitrogen is 25times that of silane, and the flow rate of ammonia is 0.5 times that ofsilane.

Condition 4 is the same as Condition 3 except for the flow rate ofammonia. Under Condition 4, the flow rate of ammonia was 15 sccm and theother conditions are the same as those of Condition 3. Note that theflow rate of nitrogen is 25 times that of silane, and the flow rate ofammonia is 0.75 times that of silane.

Samples A1 to A4 were subjected to TDS analysis.

Here, a method to measure the number of released hydrogen moleculesusing the TDS analysis is described.

The released amount of gas in the TDS analysis is proportional to anintegral value of spectrum. Therefore, the amount of released gas can becalculated from the ratio between the integral value of a spectrum of aninsulating film and the reference value of a standard sample. Thereference value of a standard sample refers to the ratio of the densityof a predetermined atom contained in a sample to the integral value of aspectrum.

For example, the number of hydrogen molecules (N_(H2)) released from aninsulating film can be obtained according Equation 1 with the TDSanalysis results of a silicon wafer containing hydrogen at apredetermined density which is the standard sample and the TDS analysisresults of the insulating film. Here, all spectra having a mass numberof 2 which are obtained by TDS analysis are assumed to originate from ahydrogen molecule. Further, an isotope of a hydrogen atom having a massnumber other than 1 is not taken into consideration because theproportion of such a molecule in the natural world is minimal.

$\begin{matrix}\left\lbrack {{Equation}\mspace{14mu} 1} \right\rbrack & \; \\{N_{H2} = {\frac{N_{{H2}{(S)}}}{S_{{H2}{(S)}}} \times S_{H2} \times \alpha}} & (1)\end{matrix}$

Note that N_(H2) is the number of the released hydrogen molecules.N_(H2(s)) is the value obtained by conversion of the number of hydrogenmolecules released from the standard sample into density. S_(H2(s)) isan integral value of spectrum of a standard sample which is analyzed byTDS. Here, the reference value of the standard sample is set toN_(H2(s))/S_(H2(s)). S_(H2) is the integral value of a spectrum when theinsulating film is subjected to TDS analysis. α is a coefficientaffecting the intensity of the spectrum in the TDS analysis. JapanesePublished Patent Application No. H6-275697 can be referred to fordetails of Equation 1.

Note that in this example, the amount of hydrogen released from each ofSamples A1 to A4 was measured with a thermal desorption spectroscopyapparatus produced by ESCO Ltd., EMD-WA1000S/W using a silicon wafercontaining hydrogen atoms at 1×10¹⁶ atoms/cm² as the standard sample.

TDS analysis results of Samples A1 to A4 having Structure 1 are shown inFIG. 22A. FIG. 22A is a graph in which the horizontal axis representssubstrate temperature and the vertical axis represents TDS intensitywith respect to the number of released hydrogen molecules. Note that theminimum detection limit of hydrogen molecules in the TDS analysis is1.0×10²¹ molecules/cm³.

In each of Samples A1 to A4, a peak indicating release of hydrogenmolecules was observed at a substrate temperature in the range of 300°C. to 600° C.; however, Samples A1 to A4 differed in TDS intensity. Thatis, Samples A1 to A4 differed in the amount of released hydrogen.

The number of hydrogen molecules released from Samples A1 to A4 was6.6×10²³ molecules/cm³, 1.1×10²³ molecules/cm³, 7.4×10²² molecules/cm³,and 8.4×10²² molecules/cm³, respectively.

FIG. 22A shows that Sample A1 had higher TDS intensity with respect tohydrogen molecules than Samples A2 to A4. That is, it was found that theamount of hydrogen contained in the silicon nitride film 993 of SampleA1 was larger than those in the silicon nitride films 993 of Samples A2to A4. These results indicate that when the flow rate of nitrogen waslarger than that of silane as in Condition 1, which is the condition ofSample A1, it was possible to form a nitride insulating film whichcontains hydrogen and releases hydrogen by heating.

The above results showed that the silicon nitride film formed underCondition 1 was suitable to the first nitride insulating film includedin the semiconductor device that is one embodiment of the presentinvention.

Example 2

In this example, evaluation results of a nitride insulating film whichis applicable to the second nitride insulating film which is included inthe semiconductor device that is one embodiment of the present inventionand functions as a barrier film against hydrogen are described. Here, afilm which is less likely to transmit hydrogen and has a barrierproperty against hydrogen is described as the nitride insulating filmapplicable to the second nitride insulating film.

Samples which were formed are described below. A structure of eachsample formed in this example is partly different from Structure 1described in Example 1 and is referred to as Structure 2. A siliconnitride film 995 is provided over the silicon wafer 991 in Structure 2,and the silicon nitride film 993 is provided over the silicon nitridefilm 995 (see FIG. 21B).

The silicon nitride film 995 was formed by a plasma CVD method underformation conditions which are applicable to the first nitrideinsulating film. Specifically, the silicon nitride film 995 was formedunder Condition 1 described in Example 1. The silicon nitride film 993was formed by a plasma CVD method under formation conditions which areapplicable to the second nitride insulating film.

The silicon nitride film 993 was formed using four conditions,Conditions 5 to 8. Samples formed under Conditions 5 to 8 were SamplesB1 to B4, respectively. In each of Samples B1 to B4, the silicon nitridefilm 993 and the silicon nitride film 995 each have a thickness of 50nm.

Condition 5 was the same as Condition 2 described in Example 1. The flowrate of nitrogen is 25 times that of silane,

Condition 6 was the same as Condition 3 described in Example 1. Notethat the flow rate of nitrogen is 25 times that of silane, and the flowrate of ammonia is 0.50 times that of silane.

Condition 7 was the same as Condition 4 described in Example 1. In otherwords, Condition 7 was the same as Condition 3 except for the flow rateof ammonia. Note that the flow rate of nitrogen is 25 times that ofsilane, and the flow rate of ammonia is 0.75 times that of silane.

Condition 8 was the same as Condition 4 described in Embodiment 1 exceptfor the flow rate of ammonia. Specifically, in Condition 4, the flowrate of ammonia was set to 20 sccm. Note that the flow rate of nitrogenis 25 times that of silane, and the flow rate of ammonia is 1.0 timesthat of silane.

Samples B1 to B4 were subjected to TDS analysis in a manner similar tothat of Example 1.

In the case of Structure 2, since the silicon nitride film 995 is thesilicon nitride film which was formed under Condition 1 and releaseshydrogen, whether or not the silicon nitride film 993 functions as abarrier film against hydrogen can be determined by comparing Samples B1to B4 in terms of TDS intensity with respect to release of hydrogen.

TDS analysis results of Samples B1 to B4 are shown in FIG. 22B.

FIG. 22B shows that Sample B4 had higher TDS intensity than Samples B1to B3. FIG. 22B also shows that as the flow rate of ammonia used as thesource gas of the silicon nitride film 993 was increased, the TDSintensity became higher.

It was found that the TDS intensity in FIG. 22B was substantially thesame as the TDS intensity of Samples A2 to A4 described in Example 1although the silicon nitride film 995 releasing hydrogen was provided inSamples B1 to B3. That is, it was confirmed that the silicon nitridefilm 993 in each of Samples B1 to B3 was a silicon nitride film which isless likely to transmit hydrogen. Accordingly, it was shown that when asilicon nitride film was formed using nitrogen, silane, and ammonia assource gases under a condition where the flow rate of nitrogen wasgreater than or equal to 10 times and less than or equal to 100 times(preferably greater than or equal to 15 times and less than or equal to40 times) that of silane and the flow rate of ammonia was greater thanor equal to 0.1 times and less than 1 time (preferably greater than orequal to 0.2 times and less than or equal to 0.75 times) that of silaneas described in Embodiment 1, the silicon nitride film was less likelyto transmit hydrogen and served as a barrier film against hydrogen.

As described above, the silicon nitride film formed using the formationmethod of one embodiment of the present invention can be applied to thesecond nitride insulating film which is included in the semiconductordevice that is one embodiment of the present invention and functions asa barrier film against hydrogen.

Example 3

Example 2 shows that the silicon nitride film 993 formed under any ofConditions 5 to 7 was a silicon nitride film which was less likely totransmit hydrogen and had a barrier property against hydrogen. In viewof this fact, evaluation results of the refractive index, the filmdensity, the etching rate, and the hydrogen concentration of such asilicon nitride film are described in this example.

First, the structure of formed samples was Structure 1 described inExample 1 (see FIG. 21A). The silicon nitride film 993 was formed by aplasma CVD method under Conditions 5 to 8 described in Example 2. Thesamples manufactured in this example are Samples C1 to C4 whichcorrespond to Conditions 5 to 8, respectively. Note that in each ofSamples C1 to C4, the silicon nitride film 993 had a thickness of 50 nm.

The refractive index of the silicon nitride film 993 with respect tolight having a wavelength of 633 nm in each of Samples C1 to C4 wasobtained by spectroscopic ellipsometry. The film density was obtained byX-ray reflectometry. The etching rate was obtained under a conditionwhere etching was performed at a temperature higher than or equal to 20°C. and lower than or equal to 25° C. with the use of 0.5 wt % ofhydrofluoric acid.

Samples C1 to C4 were subjected to the above variety of measurements.The measured refractive index of the silicon nitride film 993 in each ofSamples C1 to C4 is shown in FIG. 23A. The measured film density of thesilicon nitride film 993 is shown in FIG. 23B. The measured etching rateof the silicon nitride film 993 is shown in FIG. 24.

FIG. 23A is a graph showing the refractive index of each sample versusthe flow ratio of silane and ammonia which were supplied at the time offormation of the silicon nitride film 993. FIG. 23B is a graph showingthe film density of each sample versus the flow ratio of silane andammonia which were supplied at the time of formation of the siliconnitride film 993. FIG. 24 is a graph showing the etching rate of eachsample versus the flow ratio of silane and ammonia which were suppliedat the time of formation of the silicon nitride film 993. In each ofFIGS. 23A and 23B and FIG. 24, ammonia was not supplied in the case ofSample C1.

It was found that the silicon nitride films which were less likely totransmit hydrogen (Samples C1 to C3) had a refractive index of 1.95 ormore (see FIG. 23A), a film density of 2.75 g/cm³ or more (see FIG.23B), and an etching rate of less than approximately 2.0 nm/minute (seeFIG. 24).

Next, evaluation results of samples having Structure 1 which wereobtained by changing the formation conditions of the silicon nitridefilm 993. Evaluated items are the refractive index, the film density,the etching rate, and the concentration of hydrogen contained in thesilicon nitride film 993.

Here, the formation conditions of the silicon nitride film 993 are fourconditions, Conditions 9 to 12. Samples formed under Conditions 9 to 12are Samples D1 to D4, respectively.

Condition 9 was as follows: a temperature at which the silicon wafer 991was held was 350° C.; silane with a flow rate of 200 sccm and nitrogenwith a flow rate of 5000 sccm were used as source gases; a pressure in atreatment chamber was 100 Pa; and a high-frequency power of 2000 W(3.0×10⁻¹ W/cm² as a power density) at 27.12 MHz was supplied toparallel plate electrodes. Note that the flow rate of nitrogen is 25times that of silane.

Condition 10 was as follows: a temperature at which the silicon wafer991 was held was 350° C.; silane with a flow rate of 200 sccm, nitrogenwith a flow rate of 2000 sccm, and ammonia with a flow rate of 100 sccmwere used as source gases; a pressure in a treatment chamber was 100 Pa;and a high-frequency power of 2000 W (3.0×10⁻¹ W/cm² as a power density)at 27.12 MHz was supplied to parallel plate electrodes. The flow rate ofnitrogen is 10 times that of silane, and the flow rate of ammonia is 0.5times that of silane.

Condition 11 is the same as Condition 10 except that the flow rate ofammonia is 500 sccm. Note that the flow rate of nitrogen is 10 timesthat of silane, and the flow rate of ammonia is 2.5 times that ofsilane.

Condition 12 is the same as Condition 10 except that the flow rate ofammonia is 2000 sccm. Note that the flow rate of nitrogen is 10 timesthat of silane, and the flow rate of ammonia is 10 times that of silane.

Samples D1 to D4 were subjected to a variety of measurements. Therefractive index of the silicon nitride film 993 with respect to lighthaving a wavelength of 633 nm in each of Samples D1 to D4 was obtainedby spectroscopic ellipsometry. The film density was obtained by X-rayreflectometry. The etching rate was obtained under a condition whereetching was performed at a temperature higher than or equal to 20° C.and lower than or equal to 25° C. with the use of 0.5 wt % ofhydrofluoric acid.

The refractive index of each of Samples D1 to D4 is shown in FIG. 25A.The film density thereof is shown in FIG. 25B. The etching rate thereofis shown in FIG. 26.

It was found that Sample D1 and Sample D2 had a refractive index of 1.95or more (see FIG. 25A), a film density of 2.75 g/cm³ or more (see FIG.25B), and an etching rate of less than 2.0 nm/minute (see FIG. 26).

Next, samples which had Structure 1 and in which the thickness of thesilicon nitride film 993 was 300 nm were manufactured under Condition 9,Condition 10, and Condition 12. The samples manufactured under Condition9, Condition 10, and Condition 12 are Sample E1, Sample E2, and SampleE3, respectively.

Samples E1 to E3 were subjected to Rutherford backscatteringspectrometry to measure the concentration of hydrogen contained in thesilicon nitride film 993 in each of the samples. The results are shownin Table 1.

TABLE 1 Si N H O [atomic %] [atomic %] [atomic %] [atomic %] Sample E139.5 50.6 9.9 Lower detection limit Sample E2 36.2 50.3 13.5 Lowerdetection limit Sample E3 31.6 47.6 20.8 Lower detection limit

Table 1 shows that the silicon nitride film had a hydrogen concentrationof 15 atomic % or less in each of Samples E1 and E2 including thesilicon nitride film which was less likely to transmit hydrogen.Further, the flow ratio of ammonia to silane is high (specifically, theflow rate of ammonia is 10 times that of silane) as for the source gas;therefore, it was found that the silicon nitride film had aconcentration of hydrogen of 20 atomic % or more in Sample E3 includingthe silicon nitride film releasing hydrogen.

According to the above results, it was found that the hydrogenconcentration of the silicon nitride film suitable to the first nitrideinsulating film included in the semiconductor device that is oneembodiment of the present invention, which was measured by Rutherfordbackscattering spectrometry, was greater than or equal to 10 atomic %and less than or equal to 15 atomic %. Further, it was shown that thehydrogen concentration of the silicon nitride film suitable to thesecond nitride insulating film which is included in the semiconductordevice that is one embodiment of the present invention and functions asa bather film against hydrogen, which was measured by Rutherfordbackscattering spectrometry, was higher than or equal to 20 atomic % andlower than or equal to 25 atomic %.

This application is based on Japanese Patent Application serial no.2012-167614 filed with Japan Patent Office on Jul. 27, 2012, andJapanese Patent Application serial no. 2012-167615 filed with JapanPatent Office on Jul. 27, 2012, the entire contents of which are herebyincorporated by reference.

What is claimed is:
 1. A semiconductor device comprising: a first transistor comprising a silicon semiconductor film including a first channel formation region; an insulating film comprising a first nitride insulating film and a second nitride insulating film over the first transistor; a second transistor comprising an oxide semiconductor film including a second channel formation region over the insulating film; and a third nitride insulating film over the second transistor, wherein the second nitride insulating film is provided between the first nitride insulating film and the oxide semiconductor film, wherein a hydrogen concentration of the second nitride insulating film is lower than a hydrogen concentration of the first nitride insulating film, wherein an etching rate of the second nitride insulating film is less than or equal to 2.0 nm/minute under a condition where etching is performed at a temperature higher than or equal to 20° C. and lower than or equal to 25° C. with the use of 0.5 wt % of hydrofluoric acid, and wherein an etching rate of the third nitride insulating film is less than or equal to 2.0 nm/minute under a condition where etching is performed at a temperature higher than or equal to 20° C. and lower than or equal to 25° C. with the use of 0.5 wt % of hydrofluoric acid.
 2. The semiconductor device according to claim 1, wherein a density of the second nitride insulating film is greater than or equal to 2.75 g/cm³.
 3. The semiconductor device according to claim 1, wherein the hydrogen concentration of the first nitride insulating film is higher than or equal to 20 atomic % and lower than or equal to 25 atomic %.
 4. The semiconductor device according to claim 1, wherein the hydrogen concentration of the second nitride insulating film is higher than or equal to 10 atomic % and lower than or equal to 15 atomic %.
 5. The semiconductor device according to claim 1, wherein the second nitride insulating film is in contact with the first nitride insulating film.
 6. The semiconductor device according to claim 1, wherein the first transistor and the second transistor each have a top-gate structure.
 7. The semiconductor device according to claim 1, wherein the insulating film further comprises an oxide insulating film provided between and in contact with the first nitride insulating film and the second nitride insulating film.
 8. The semiconductor device according to claim 1, wherein a density of the third nitride insulating film is greater than or equal to 2.75 g/cm³.
 9. The semiconductor device according to claim 1, wherein a hydrogen concentration of the third nitride insulating film is higher than or equal to 10 atomic % and lower than or equal to 15 atomic %.
 10. The semiconductor device according to claim 1, wherein the oxide semiconductor film comprises indium, gallium, and zinc.
 11. A semiconductor device comprising: a first transistor comprising a silicon semiconductor film including a first channel formation region; an insulating film over the first transistor, the insulating film comprising a first nitride insulating film, and a second nitride insulating film over the first nitride insulating film; a second transistor over the insulating film, the second transistor comprising a first electrode, a second electrode, and an oxide semiconductor film including a second channel formation region; and a third nitride insulating film over the second transistor, wherein each of the first electrode and the second electrode overlaps with the second channel formation region, wherein the first electrode is in contact with the second nitride insulating film, wherein a hydrogen concentration of the second nitride insulating film is lower than a hydrogen concentration of the first nitride insulating film, wherein an etching rate of the second nitride insulating film is less than or equal to 2.0 nm/minute under a condition where etching is performed at a temperature higher than or equal to 20° C. and lower than or equal to 25° C. with the use of 0.5 wt % of hydrofluoric acid, and wherein an etching rate of the third nitride insulating film is less than or equal to 2.0 nm/minute under a condition where etching is performed at a temperature higher than or equal to 20° C. and lower than or equal to 25° C. with the use of 0.5 wt % of hydrofluoric acid.
 12. The semiconductor device according to claim 11, wherein a density of the second nitride insulating film is greater than or equal to 2.75 g/cm³.
 13. The semiconductor device according to claim 11, wherein the hydrogen concentration of the second nitride insulating film is higher than or equal to 10 atomic % and lower than or equal to 15 atomic %.
 14. The semiconductor device according to claim 11, wherein the oxide semiconductor film comprises indium, gallium, and zinc.
 15. A semiconductor device comprising: a first transistor comprising a silicon semiconductor film including a first channel formation region; an insulating film over the first transistor, the insulating film comprising a first nitride insulating film, and a second nitride insulating film over and in contact with the first nitride insulating film; a second transistor over the insulating film, the second transistor comprising a first electrode, a second electrode, and an oxide semiconductor film including a second channel formation region; and a third nitride insulating film over the second transistor, wherein each of the first electrode and the second electrode overlaps with the second channel formation region, wherein the first electrode is in contact with the first nitride insulating film, wherein a hydrogen concentration of the second nitride insulating film is lower than a hydrogen concentration of the first nitride insulating film, wherein an etching rate of the second nitride insulating film is less than or equal to 2.0 nm/minute under a condition where etching is performed at a temperature higher than or equal to 20° C. and lower than or equal to 25° C. with the use of 0.5 wt % of hydrofluoric acid, and wherein an etching rate of the third nitride insulating film is less than or equal to 2.0 nm/minute under a condition where etching is performed at a temperature higher than or equal to 20° C. and lower than or equal to 25° C. with the use of 0.5 wt % of hydrofluoric acid.
 16. The semiconductor device according to claim 15, wherein a density of the second nitride insulating film is greater than or equal to 2.75 g/cm³.
 17. The semiconductor device according to claim 15, wherein the hydrogen concentration of the second nitride insulating film is higher than or equal to 10 atomic % and lower than or equal to 15 atomic %. 